生命周期: | Obsolete | 零件包装代码: | TSOP2 |
包装说明: | TSSOP, | 针数: | 66 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.24 | 风险等级: | 5.62 |
访问模式: | FOUR BANK PAGE BURST | 最长访问时间: | 0.75 ns |
其他特性: | AUTO/SELF REFRESH | JESD-30 代码: | R-PDSO-G66 |
长度: | 22.22 mm | 内存密度: | 268435456 bit |
内存集成电路类型: | DDR DRAM | 内存宽度: | 16 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 66 | 字数: | 16777216 words |
字数代码: | 16000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 16MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 自我刷新: | YES |
最大供电电压 (Vsup): | 2.7 V | 最小供电电压 (Vsup): | 2.3 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 宽度: | 10.16 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M13S2561616A-6TIG2A | ESMT |
获取价格 |
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, TSOP2 | |
M13S2561616A-6TIG2K | ESMT |
获取价格 |
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, TSOP2 | |
M13S2561616A-6TIG2S | ESMT |
获取价格 |
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, TSOP2 | |
M13S256328A | ESMT |
获取价格 |
2M x 32 Bit x 4 Banks Double Data Rate SDRAM | |
M13S256328A-5BG | ESMT |
获取价格 |
2M x 32 Bit x 4 Banks Double Data Rate SDRAM | |
M13S32321A | ESMT |
获取价格 |
256K x 32 Bit x 4 Banks Double Data Rate SDRAM | |
M13S32321A_08 | ESMT |
获取价格 |
256K x 32 Bit x 4 Banks Double Data Rate SDRAM | |
M13S32321A-5BG2G | ESMT |
获取价格 |
DDR DRAM, 1MX32, 0.7ns, CMOS, PBGA144, FBGA-144 | |
M13S32321A-5L | ESMT |
获取价格 |
256K x 32 Bit x 4 Banks Double Data Rate SDRAM | |
M13S32321A-6BG2G | ESMT |
获取价格 |
DDR DRAM, 1MX32, 0.7ns, CMOS, PBGA144, FBGA-144 |