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LX5503-LQ PDF预览

LX5503-LQ

更新时间: 2024-11-10 22:46:51
品牌 Logo 应用领域
美高森美 - MICROSEMI 射频和微波射频放大器微波放大器功率放大器
页数 文件大小 规格书
13页 478K
描述
InGaP HBT 5-6GHz Power Amplifier

LX5503-LQ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not RecommendedReach Compliance Code:unknown
风险等级:5.17Is Samacsys:N
特性阻抗:50 Ω构造:COMPONENT
增益:16 dB最大输入功率 (CW):10 dBm
JESD-609代码:e3最大工作频率:6000 MHz
最小工作频率:5000 MHz最高工作温度:85 °C
最低工作温度:-40 °C射频/微波设备类型:WIDE BAND LOW POWER
端子面层:MATTE TINBase Number Matches:1

LX5503-LQ 数据手册

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LX5503  
InGaP HBT 5-6GHz Power Amplifier  
I N T E G R A T E D P R O D U C T S  
PRODUCTION DATA SHEET  
KEY FEATURES  
DESCRIPTION  
Advanced InGaP HBT  
5.15-5.85GHz Operation  
Single-Polarity 3.3V Supply  
Low Quiescent Current Icq  
~100mA  
The LX5503 is a power amplifier  
optimized for the FCC Unlicensed (64QAM, 54Mbps), the PA provides a  
National Information Infrastructure very  
(U-NII) band and HiperLAN2 Magnitude) of 4%, and consumes less  
applications in the 5.15-5.85GHz than 200mA total DC current.  
For +18dBm OFDM output power  
low  
EVM  
(Error-Vector  
P1dB ~ +25dBm across  
5.15~5.85GHz  
frequency range. The PA is im-  
The LX5503 is available in a 16-pin  
plemented as a two-stage monolithic 3mmx3mm micro-lead package (MLP).  
microwave integrated circuit (MMIC) The compact footprint, low profile, and  
with active bias and input/output pre- excellent thermal capability of the MLP  
matching. The device is manufactured package makes the LX5503 an ideal  
with an InGaP/GaAs Heterojunction solution for broadband, medium-gain  
Bipolar Transistor (HBT) IC process power amplifier requirements for IEEE  
(MOCVD). It operates at a single low 802.11a, and Hiperlan2 portable WLAN  
voltage supply of 3.3V with +25dBm applications.  
Power Gain ~ 22dB at 5.25GHz  
& Pout=18dBm  
Power Gain ~ 18dB at 5.85GHz  
& Pout=18dBm  
Total Current < 200mA for  
Pout=18dBm  
EVM ~ 4% for 64QAM/ 54Mbps  
& Pout=18dBm  
Excellent Temperature  
Performance  
of P1dB and 22dB power gain  
between 5.15-5.35GHz and 18dB gain  
up to 5.85GHz.  
Simple Input/Output Match  
Minimal External Components  
Small Footprint: 3x3mm2  
Low Profile: 0.9mm  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
APPLICATIONS/BENEFITS  
FCC U-NII Wireless  
IEEE 802.11a  
HiperLAN2  
PRODUCT HIGHLIGHT  
PACKAGE ORDER INFO  
Plastic  
16-Pin  
TJ (°C)  
LQ  
-40 to 85  
LX5503-LQ  
Note: Available in Tape & Reel (3K parts per reel).  
Append the letter “T” to the part number.  
(i.e. LX5503-LQT)  
This device is classified as ESD Level 1 in accordance with MIL-  
STD-883, Method 3015 (HBM) testing. Appropriate ESD procedures  
should be observed when handling this device.  
Copyright 2000  
Microsemi  
Page 1  
Rev. 1.1, 9/16/2002  
Integrated Products Division  
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570  

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