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LV8075LP-E PDF预览

LV8075LP-E

更新时间: 2024-11-25 12:49:15
品牌 Logo 应用领域
安森美 - ONSEMI 驱动器运动控制电子器件信号电路电机信息通信管理
页数 文件大小 规格书
4页 62K
描述
Constant-voltage Control 1-channel Forward/Reverse Motor Driver

LV8075LP-E 技术参数

是否无铅: 不含铅生命周期:Obsolete
针数:16Reach Compliance Code:compliant
Factory Lead Time:1 week风险等级:8.42
Is Samacsys:NJESD-30 代码:S-PQCC-N16
湿度敏感等级:1端子数量:16
最高工作温度:85 °C最低工作温度:-30 °C
封装主体材料:PLASTIC/EPOXY封装代码:QCCN
封装等效代码:LCC16,.10SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER电源:3 V
认证状态:Not Qualified子类别:Motion Control Electronics
最大供电电流 (Isup):1 mA标称供电电压 (Vsup):3 V
表面贴装:YES技术:BICMOS
温度等级:OTHER端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
Base Number Matches:1

LV8075LP-E 数据手册

 浏览型号LV8075LP-E的Datasheet PDF文件第2页浏览型号LV8075LP-E的Datasheet PDF文件第3页浏览型号LV8075LP-E的Datasheet PDF文件第4页 
Ordering number : ENA1133A  
LV8075LP  
Bi-CMOS LSI  
Constant-voltage Control 1-channel  
http://onsemi.com  
Forward/Reverse Motor Driver  
Overview  
LV8075LP is a constant voltage control 1-channel forward/reverse motor driver IC.  
Features  
Constant voltage control forward/reverse H-bridge  
Parallel input-Analog value must be entered for constant voltage reference input  
V (OUT) = V (VC) × 2.0  
Built-in thermal protection circuit and under-voltage detection protection circuit  
Specifications  
Absolute Maximum Ratings at Ta = 25°C, SGND = PGND = 0V  
Parameter  
Symbol  
Conditions  
Ratings  
Unit  
V
Maximum control power supply voltage  
Maximum load power supply voltage  
Maximum control pin voltage  
Maximum output current  
V
max  
6
CC  
VM max  
6
V
V
I
max  
max  
6
0.5  
V
C
OUT1, 2  
VREF  
A
O
VREF maximum current  
IREF max  
Pd max  
Topr  
1
mA  
mW  
°C  
°C  
Allowable power dissipation  
Operating temperature  
Mounted on a circuit board*  
700  
-30 to +85  
-40 to +150  
Storage temperature  
Tstg  
* Specified circuit board : 40.0×50.0×0.8mm3 : glass epoxy four-layer board  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating  
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.  
Semiconductor Components Industries, LLC, 2013  
May, 2013  
21710 SY 20100210-S00003 / 51408 MS PC 20080408-S00008 No.A1133-1/4  

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