是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | MSOP | 包装说明: | TSSOP, TSSOP10,.19,20 |
针数: | 10 | Reach Compliance Code: | compliant |
风险等级: | 8.44 | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | S-PDSO-G10 | JESD-609代码: | e3 |
长度: | 3 mm | 功能数量: | 2 |
端子数量: | 10 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | TSSOP | 封装等效代码: | TSSOP10,.19,20 |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 1.1 mm |
最大供电电流 (Isup): | 9.5 mA | 最大供电电压 (Vsup): | 16 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 12.4 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 2 mm | Base Number Matches: | 1 |
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