是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | DIP | 包装说明: | DIP, DIP18,.3 |
针数: | 18 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.02 | Is Samacsys: | N |
其他特性: | IT CAN ALSO BE OPERATED FROM A +/-5V DUAL SUPPLY | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | R-PDIP-T18 | JESD-609代码: | e0 |
湿度敏感等级: | 1 | 功能数量: | 2 |
端子数量: | 18 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | DIP | 封装等效代码: | DIP18,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 4.191 mm | 子类别: | Other Analog ICs |
最大供电电流 (Isup): | 1 mA | 最大供电电压 (Vsup): | 18 V |
最小供电电压 (Vsup): | 3 V | 标称供电电压 (Vsup): | 10 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7.62 mm | Base Number Matches: | 1 |
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