TM
Tgon 800 Series
Electrically and Thermally
Conductive Interface Pad
Innovative Technology
for a Connected World
HꢀꢁH-PERFORMANCE, COST EFFECTꢀvE THERMAl ꢀNTERFACE MATERꢀAl
Used where electrical isolation is not required, Tgon™ 800 is ideal for where electrical
contact and thermal transfer are desired.
Its unique grain-oriented, plate-like structure provides a high thermal conductivity of
240 W/mK in the XY plane and 5 W/mK through the z-axis.. Tgon 800 can be supplied
in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut
to specific configurations.
It is also available with proprietary pressure sensitive adhesive on one side. This adhesive
coating is the thinnest available, minimizing any impact on thermal performance.
FEATURES
• High thermal conductivity of 5 W/mK in Z axis and 240 W/mK in the X-Y axis
• >98% graphite
• Low thermal resistance
• Thicknesses of 0.005”, 0.010” and 0.020” (0.125mm, 0.25mm, and 0.50mm)
APPlꢀCATꢀONS
• Power conversion equipment
• Power supplies
• Large telecommunications switching hardware
• Notebook computers
• Where electrical grounding is required with good thermal conductivity
global solutions: local supportTM
Americas: +1.888.246.9050
Europe: +49.0.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal