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LSM330DLTR

更新时间： 2024-11-25 11:44:03
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 传感器
页数 文件大小 规格书
54页 1066K
描述
Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor

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中文翻译

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LSM330DLTR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：LGA
包装说明：TFLGA,针数：28
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.58模拟集成电路 - 其他类型：ANALOG CIRCUIT
JESD-30 代码：R-PBGA-B28长度：7.5 mm
功能数量：1端子数量：28
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：TFLGA
封装形状：RECTANGULAR封装形式：GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
座面最大高度：1.1 mm最大供电电压 (Vsup)：3.6 V
最小供电电压 (Vsup)：2.4 V标称供电电压 (Vsup)：3 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：BUTT
端子节距：0.6 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：4.4 mm
Base Number Matches：1

LSM330DLTR 数据手册

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LSM330DL  
Linear sensor module  
3D accelerometer sensor and 3D gyroscope sensor  
Preliminary data  
Features  
■ Analog supply voltage 2.4 V to 3.6 V  
■ Digital supply voltage I/Os, 1.8V  
■ Low-power mode  
■ Power-down mode  
LLGA 28L 7.5 x 4.4 x 1.1 mm  
■ 3 independent acceleration channels and 3  
ST’s family of modules leverages a robust and  
mature manufacturing process already used for  
the production of micromachined accelerometers.  
angular rate channels  
■
■
2g/ 4g/ 8g/ 16g dynamic, selectable full-  
scale acceleration range  
The various sensing elements are manufactured  
using specialized micromachining processes,  
while the IC interfaces are based on CMOS  
technology that allows designing a dedicated  
circuit which is trimmed to better match the  
sensing element characteristics.  
250/ 500/ 2000 dps dynamic, selectable full-  
scale angular rate  
2
■ SPI/I C serial interface (16-bit data output)  
■ Programmable interrupt generator for free-fall  
and motion detection  
®
■ ECOPACK , RoHS, and “Green” compliant  
The LSM330DL has a dynamic, user-selectable  
full-scale acceleration range of 2g/ 4g/ 8g/ 16g  
and an angular rate of 250/ 500/ 2000 deg/sec.  
Applications  
The accelerometer and gyroscope sensors can  
be either activated or put in low-power / power-  
down mode separately for power-saving  
optimized applications. The LSM330DL is  
available in a plastic land grid array (LGA)  
package.  
■ GPS navigation systems  
■ Impact recognition and logging  
■ Gaming and virtual reality input devices  
■ Motion-activated functions  
■ Intelligent power saving for handheld devices  
■ Vibration monitoring and compensation  
■ Free-fall detection  
Several years ago ST successfully pioneered the  
use of this package for accelerometers. Today, ST  
has the broadest manufacturing capability in the  
world and unrivalled expertise for the production  
of sensors in a plastic LGA package.  
■ 6D-orientation detection  
Description  
The LSM330DL is a system-in-package featuring  
a 3D digital accelerometer and a 3D digital  
gyroscope.  
Table 1.  
Device summary  
Part number  
Temperature range [°C]  
Package  
Packing  
LSM330DL  
-40 to +85  
-40 to +85  
LGA-28  
LGA-28  
Tray  
LSM330DLTR  
Tape & reel  
July 2011  
Doc ID 022018 Rev 1  
1/54  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to  
change without notice.  
www.st.com  
54  
 
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