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LSM330DL PDF预览

LSM330DL

更新时间: 2024-11-25 11:44:03
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 传感器
页数 文件大小 规格书
54页 1066K
描述
Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor

LSM330DL 数据手册

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LSM330DL  
Linear sensor module  
3D accelerometer sensor and 3D gyroscope sensor  
Preliminary data  
Features  
Analog supply voltage 2.4 V to 3.6 V  
Digital supply voltage I/Os, 1.8V  
Low-power mode  
Power-down mode  
LLGA 28L 7.5 x 4.4 x 1.1 mm  
3 independent acceleration channels and 3  
ST’s family of modules leverages a robust and  
mature manufacturing process already used for  
the production of micromachined accelerometers.  
angular rate channels  
2g/ 4g/ 8g/ 16g dynamic, selectable full-  
scale acceleration range  
The various sensing elements are manufactured  
using specialized micromachining processes,  
while the IC interfaces are based on CMOS  
technology that allows designing a dedicated  
circuit which is trimmed to better match the  
sensing element characteristics.  
250/ 500/ 2000 dps dynamic, selectable full-  
scale angular rate  
2
SPI/I C serial interface (16-bit data output)  
Programmable interrupt generator for free-fall  
and motion detection  
®
ECOPACK , RoHS, and “Green” compliant  
The LSM330DL has a dynamic, user-selectable  
full-scale acceleration range of 2g/ 4g/ 8g/ 16g  
and an angular rate of 250/ 500/ 2000 deg/sec.  
Applications  
The accelerometer and gyroscope sensors can  
be either activated or put in low-power / power-  
down mode separately for power-saving  
optimized applications. The LSM330DL is  
available in a plastic land grid array (LGA)  
package.  
GPS navigation systems  
Impact recognition and logging  
Gaming and virtual reality input devices  
Motion-activated functions  
Intelligent power saving for handheld devices  
Vibration monitoring and compensation  
Free-fall detection  
Several years ago ST successfully pioneered the  
use of this package for accelerometers. Today, ST  
has the broadest manufacturing capability in the  
world and unrivalled expertise for the production  
of sensors in a plastic LGA package.  
6D-orientation detection  
Description  
The LSM330DL is a system-in-package featuring  
a 3D digital accelerometer and a 3D digital  
gyroscope.  
Table 1.  
Device summary  
Part number  
Temperature range [°C]  
Package  
Packing  
LSM330DL  
-40 to +85  
-40 to +85  
LGA-28  
LGA-28  
Tray  
LSM330DLTR  
Tape & reel  
July 2011  
Doc ID 022018 Rev 1  
1/54  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to  
change without notice.  
www.st.com  
54  
 

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