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Datasheet > LSEM-150-06.0-L-DV-A-N-K
LSEM-150-06.0-L-DV-A-N-K PDF预览

LSEM-150-06.0-L-DV-A-N-K

更新时间： 2024-11-26 15:37:59
品牌 Logo 应用领域
申泰 - SAMTEC PC连接器
页数 文件大小 规格书
1页 475K
描述
Board Connector, 100 Contact(s), 2 Row(s), Hermaphroditic, Straight, 0.031 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT

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LSEM-150-06.0-L-DV-A-N-K 技术参数

生命周期：Active包装说明：ROHS COMPLIANT
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8536.69.40.40风险等级：5.75
其他特性：RAZOR BEAM SYSTEM板上安装选件：PEG
主体宽度：0.196 inch主体长度：1.748 inch
连接器类型：BOARD CONNECTOR联系完成配合：GOLD (10) OVER NICKEL
联系完成终止：MATTE TIN OVER NICKEL触点性别：HERMAPHRODITIC
触点材料：PHOSPHOR BRONZE触点模式：RECTANGULAR
触点样式：BELLOWED TYPEDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
绝缘体颜色：BLACK绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码：e3MIL 符合性：NO
插接触点节距：0.031 inch插接信息：MULTIPLE MATING PARTS AVAILABLE
混合触点：NO安装选项1：LOCKING
安装方式：STRAIGHT安装类型：BOARD
连接器数：ONEPCB行数：2
装载的行数：2最高工作温度：125 °C
最低工作温度：-55 °C选件：GENERAL PURPOSE
PCB接触模式：RECTANGULAR电镀厚度：10u inch
极化密钥：POLARIZED HOUSING额定电流（信号）：1.8 A
参考标准：UL可靠性：COMMERCIAL
子类别：Headers and Edge Type Connectors端子节距：0.8 mm
端接类型：SURFACE MOUNT触点总数：100
Base Number Matches：1

LSEM-150-06.0-L-DV-A-N-K 数据手册

  
F-214  
LSEM–120–06.0–F–DV–A–N–K–TR  
LSEM–150–04.0–F–DV–A–N–K–TR  
TM  
LSEM–120–01–L–DH–A–N–K–TR  
SYSTEM  
(0,80 mm) .0315"  
LSEM SERIES  
HIGH SPEED HERMAPHRODITIC STRIP  
High Speed/High Density  
Mates with:  
LSEM  
SPECIFICATIONS  
Audible click when  
For complete specifications and  
properly mated  
Self-mating  
system can  
reduce  
recommended PCB layouts see  
www.samtec.com?LSEM  
Low cost  
Insulator Material:  
Black Liquid Crystal Polymer  
Contact Material:  
Phosphor Bronze  
Plating:  
Blade &  
Beam  
contact  
inventory costs  
Au or Sn over  
• High retention  
contacts  
50µ" (1,27 µm) Ni  
Current Rating:  
1.8 A per pin  
(2 adjacent pins powered)  
Operating Temp Range:  
-55°C to +125°C  
RoHS Compliant:  
Yes  
• Audible click  
when mated  
Mated height  
variety/flexibility  
• Shrouded  
LSEM/LSEM  
Rated @ 3dB Insertion Loss*  
12 mm Stack Height  
Processing:  
Lead-Free Solderable:  
Yes  
SMT Lead Coplanarity:  
(0,10 mm) .004" max  
Board Stacking:  
For applications requiring more  
than two connectors per board,  
contact ipg@samtec.com  
Single-Ended Signaling  
Differential Pair Signaling  
16.5 GHz / 33 Gbps  
20.0 GHz / 40 Gbps  
*Test board losses de-embedded from performance data.  
Slim  
Row-to-Row  
design  
Complete test data available at www.samtec.com?LSEM  
or contact sig@samtec.com  
LEAD  
STYLE  
PLATING  
OPTION  
TAIL  
OPTION  
NO. PINS  
PER ROW  
RECOGNITIONS  
LSEM  
A
N
K
TR  
1
For complete scope of  
recognitions see  
www.samtec.com/quality  
Specify  
LEAD  
STYLE  
from  
–F  
–K  
= Gold flash  
on contact,  
Matte Tin on tail  
= (5,50 mm)  
.217" DIA  
–DV  
= Vertical  
20, 30, 40, 50  
Polyimide  
film Pick &  
Place Pad  
APPLICATION  
chart  
–DH  
–L  
= Right Angle  
=10µ" (0,25 µm)  
Gold on contact,  
Matte Tin on tail  
(Lead style –01 only)  
–TR  
= Tape &  
Reel  
MATED  
HEIGHT  
LSEM  
LEAD  
STYLE  
A
B
–01  
No. of positions x  
(0,80) .0315 + (4,40) .173  
NA  
NA  
(-DH only)  
MATED  
LEAD STYLE  
No. of positions x  
(4,45) (1,50)  
.175 .059  
(5,45) (2,50)  
.215 .098  
(7,45) (4,50)  
.293 .177  
HEIGHT*  
–03.0  
–04.0  
–06.0  
(0,80) .0315 + (4,40) .173  
02  
01  
(6,00) .236  
–03.0 & –03.0  
(7,00) .276  
–03.0 & –04.0  
(8,00) .315  
–04.0 & –04.0  
(0,80) .0315  
(9,00) .354  
–03.0 & –06.0  
(4,98)  
.196  
(10,00) .394  
–04.0 & –06.0  
(7,80) .307  
01  
(12,00) .472  
–06.0 & –06.0  
(5,13)  
.202  
A
*Processing conditions will  
affect mated height.  
B
02  
(1,32)  
.052  
DIA  
(0,80) .0315  
No. of positions x  
No. of positions x  
(0,80) .0315 + (1,70) .067  
(0,85)  
.033  
(1,40)  
.055  
(0,80) .0315 + (1,70) .067  
–DV  
Note: Some lengths,  
–DH  
styles and options are  
non-standard, non-returnable.  
WWW.SAMTEC.COM  
1

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