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Datasheet > LSEM-130-06.0-F-DV-A-N-K
LSEM-130-06.0-F-DV-A-N-K PDF预览

LSEM-130-06.0-F-DV-A-N-K

更新时间： 2024-11-27 08:40:55
品牌 Logo 应用领域
申泰 - SAMTEC /
页数 文件大小 规格书
1页 475K
描述
Board Connector, 60 Contact(s), 2 Row(s), Hermaphroditic, Straight, 0.031 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT

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LSEM-130-06.0-F-DV-A-N-K 数据手册

  
F-214  
LSEM–120–06.0–F–DV–A–N–K–TR  
LSEM–150–04.0–F–DV–A–N–K–TR  
TM  
LSEM–120–01–L–DH–A–N–K–TR  
SYSTEM  
(0,80 mm) .0315"  
LSEM SERIES  
HIGH SPEED HERMAPHRODITIC STRIP  
High Speed/High Density  
Mates with:  
LSEM  
SPECIFICATIONS  
Audible click when  
For complete specifications and  
properly mated  
Self-mating  
system can  
reduce  
recommended PCB layouts see  
www.samtec.com?LSEM  
Low cost  
Insulator Material:  
Black Liquid Crystal Polymer  
Contact Material:  
Phosphor Bronze  
Plating:  
Blade &  
Beam  
contact  
inventory costs  
Au or Sn over  
• High retention  
contacts  
50µ" (1,27 µm) Ni  
Current Rating:  
1.8 A per pin  
(2 adjacent pins powered)  
Operating Temp Range:  
-55°C to +125°C  
RoHS Compliant:  
Yes  
• Audible click  
when mated  
Mated height  
variety/flexibility  
• Shrouded  
LSEM/LSEM  
Rated @ 3dB Insertion Loss*  
12 mm Stack Height  
Processing:  
Lead-Free Solderable:  
Yes  
SMT Lead Coplanarity:  
(0,10 mm) .004" max  
Board Stacking:  
For applications requiring more  
than two connectors per board,  
contact ipg@samtec.com  
Single-Ended Signaling  
Differential Pair Signaling  
16.5 GHz / 33 Gbps  
20.0 GHz / 40 Gbps  
*Test board losses de-embedded from performance data.  
Slim  
Row-to-Row  
design  
Complete test data available at www.samtec.com?LSEM  
or contact sig@samtec.com  
LEAD  
STYLE  
PLATING  
OPTION  
TAIL  
OPTION  
NO. PINS  
PER ROW  
RECOGNITIONS  
LSEM  
A
N
K
TR  
1
For complete scope of  
recognitions see  
www.samtec.com/quality  
Specify  
LEAD  
STYLE  
from  
–F  
–K  
= Gold flash  
on contact,  
Matte Tin on tail  
= (5,50 mm)  
.217" DIA  
–DV  
= Vertical  
20, 30, 40, 50  
Polyimide  
film Pick &  
Place Pad  
APPLICATION  
chart  
–DH  
–L  
= Right Angle  
=10µ" (0,25 µm)  
Gold on contact,  
Matte Tin on tail  
(Lead style –01 only)  
–TR  
= Tape &  
Reel  
MATED  
HEIGHT  
LSEM  
LEAD  
STYLE  
A
B
–01  
No. of positions x  
(0,80) .0315 + (4,40) .173  
NA  
NA  
(-DH only)  
MATED  
LEAD STYLE  
No. of positions x  
(4,45) (1,50)  
.175 .059  
(5,45) (2,50)  
.215 .098  
(7,45) (4,50)  
.293 .177  
HEIGHT*  
–03.0  
–04.0  
–06.0  
(0,80) .0315 + (4,40) .173  
02  
01  
(6,00) .236  
–03.0 & –03.0  
(7,00) .276  
–03.0 & –04.0  
(8,00) .315  
–04.0 & –04.0  
(0,80) .0315  
(9,00) .354  
–03.0 & –06.0  
(4,98)  
.196  
(10,00) .394  
–04.0 & –06.0  
(7,80) .307  
01  
(12,00) .472  
–06.0 & –06.0  
(5,13)  
.202  
A
*Processing conditions will  
affect mated height.  
B
02  
(1,32)  
.052  
DIA  
(0,80) .0315  
No. of positions x  
No. of positions x  
(0,80) .0315 + (1,70) .067  
(0,85)  
.033  
(1,40)  
.055  
(0,80) .0315 + (1,70) .067  
–DV  
Note: Some lengths,  
–DH  
styles and options are  
non-standard, non-returnable.  
WWW.SAMTEC.COM  
1

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