Datasheet > LR164-MBTG1GE

LR164-MBTG1GE

更新时间： 2024-10-29 15:37:43

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		内存集成电路
页数	文件大小	规格书
49页	393K
描述
SPECIALTY MEMORY CIRCUIT, UUC, WAFER

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中文翻译

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技术参数
数据手册

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LR164-MBTG1GE 技术参数

生命周期：	Obsolete	零件包装代码：	WAFER
包装说明：	,	Reach Compliance Code：	unknown
HTS代码：	8542.32.00.71	风险等级：	5.84
JESD-30 代码：	X-XUUC-N	内存集成电路类型：	MEMORY CIRCUIT
封装主体材料：	UNSPECIFIED	封装形状：	UNSPECIFIED
封装形式：	UNCASED CHIP	认证状态：	Not Qualified
表面贴装：	YES	端子形式：	NO LEAD
端子位置：	UPPER	Base Number Matches：	1

LR164-MBTG1GE 数据手册

LRI64

Memory tag IC at 13.56 MHz, with 64-bit unique ID and WORM

user area, ISO 15693 and ISO 18000-3 Mode 1 compliant

Features

■ ISO 15693 compliant

■ ISO 18000-3 Mode 1 compliant

■ 13.56 MHz ±7 kHz carrier frequency

■ Supported data transfer to the LRI64:

10% ASK modulation using “1-out-of-4” pulse

position coding (26 Kbit/s)

UFDFPN8 (MB)

2 × 3 mm² (MLP)

■ Supported data transfer from the LRI64:

Load modulation using Manchester coding with

423 kHz single subcarrier in fast data rate

(26 Kbit/s)

■ Internal tuning capacitor (21 pF, 28.5 pF,

97 pF)

■ 7 × 8 bits WORM user area

■ 64-bit unique identifier (UID)

■ Read Block and Write Block commands (8-bit

blocks)

■ 7 ms programming time (typical)

■ More than 40-year data retention

■ Electrical article surveillance (EAS) capable

(software controlled)

– Unsawn wafer

– Bumped and sawn wafer

■ Packages

– ECOPACK® (RoHS compliant)

August 2008

Rev 8

1/49

www.st.com

12 3 4 5 6 7...49

中文翻译

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