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LP9435LT1G_15 PDF预览

LP9435LT1G_15

更新时间: 2024-10-30 01:14:59
品牌 Logo 应用领域
乐山 - LRC /
页数 文件大小 规格书
4页 416K
描述
30V P-Channel Enhancement-Mode MOSFET

LP9435LT1G_15 数据手册

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LESHAN RADIO COMPANY, LTD.  
30V P-Channel Enhancement-Mode MOSFET  
VDS= -30V  
LP9435LT1G  
RDS(ON), Vgs@-10V, Ids@-5.3A = 70m  
RDS(ON), Vgs@-4.5V, Ids@-4.2A = 100mΩ  
S-LP9435LT1G  
3
Features  
Advanced trench process technology  
1
High Density Cell Design For Ultra Low On-Resistance  
Improved Shoot-Through FOM  
2
SOT– 23 (TO–236AB)  
S- Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC-Q101  
Qualified and PPAP Capable.  
3
2
D
S
Simple Drive Requirement  
Small Package Outline  
Surface Mount Device  
G
1
Ordering Information  
Device  
Marking  
Shipping  
LP9435LT1G  
S-LP9435LT1G  
P94  
3000/Tape&Reel  
LP9435LT3G  
S-LP9435LT3G  
10000/Tape&Reel  
P94  
Maximum Ratings and Thermal Characteristics (TA = 25oC unless otherwise noted)  
Symbol  
VDS  
Parameter  
Limit  
-30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain Current  
V
VGS  
ID  
± 20  
-5.3  
A
Pulsed Drain Current 1)  
IDM  
-20  
TA = 25oC  
TA = 75oC  
1.4  
PD  
Maximum Power Dissipation  
W
0.8  
oC  
TJ, Tstg  
RθJC  
Operating Junction and Storage Temperature Range  
-55 to 150  
50  
Junction-to-Case Thermal Resistance  
oC/W  
Junction-to-Ambient Thermal Resistance (PCB mounted) 2)  
RθJA  
90  
Note: 1. Repetitive Rating: Pulse width limited by the maximum junction temperature  
2. 1-in2 2oz Cu PCB board  
3. Guaranteed by design; not subject to production testing  
Rev .O 1/4  

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