LESHAN RADIO COMPANY, LTD.
Power MOSFET
20 V, 285 mA, P−Channel with ESD
Protection, SOT−723
LNTK3043PT5G
Features
S-LNTK3043PT5G
• Enables High Density PCB Manufacturing
• 44% Smaller Footprint than SC−89 and 38% Thinner than SC−89
• Low Voltage Drive Makes this Device Ideal for Portable Equipment
V
R
DS(on)
TYP
I Max
D
(BR)DSS
1.5 W @ 4.5 V
• Low Threshold Levels, V
< 1.3 V
GS(TH)
• Low Profile (< 0.5 mm) Allows It to Fit Easily into Extremely Thin
Environments such as Portable Electronics
2.4 W @ 2.5 V
5.1 W @ 1.8 V
6.8 W @ 1.65 V
285 mA
20 V
• Operated at Standard Logic Level Gate Drive, Facilitating Future
Migration to Lower Levels Using the Same Basic Topology
• These are Pb−Free Devices
Top View
3
• S- Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC-Q101 Qualified and
PPAP Capable.
Applications
• Interfacing, Switching
• High Speed Switching
• Cellular Phones, PDAs
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
20
Unit
V
1
2
V
DSS
1 − Gate
2 − Source
3 − Drain
Gate−to−Source Voltage
V
10
V
GS
Continuous Drain
Current (Note 1)
Steady
State
T
= 25°C
= 85°C
= 25°C
255
185
285
440
A
T
A
I
mA
D
t v 5 s
T
A
MARKING
DIAGRAM
Power Dissipation
(Note 1)
Steady
State
T
A
= 25°C
P
mW
D
D
t v 5 s
545
210
155
310
KB
1
Continuous Drain
Current (Note 2)
T
A
= 25°C
= 85°C
= 25°C
I
D
SOT−723
CASE 631AA
mA
T
A
Steady
State
Power Dissipation
(Note 2)
T
A
P
mW
KB = Device Code
= Date Code
M
Pulsed Drain Current
I
400
mA
t
= 10 ms
p
DM
Operating Junction and Storage Temperature T , T
−55 to
150
°C
J
STG
ORDERING INFORMATION
Source Current (Body Diode) (Note 2)
I
286
260
mA
S
†
Device
Package
Shipping
Lead Temperature for Soldering Purposes
(1/8” from case for 10 seconds)
°C
LNTK3043PT5G
S-LNTK3043PT5G
T
L
SOT−723* 8000 / Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
(Cu area = 1.127 in sq [1 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad size.
Rev .O 1/5
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