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LMV934IDRE4 PDF预览

LMV934IDRE4

更新时间: 2024-11-28 23:13:31
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路光电二极管输出元件输入元件信息通信管理
页数 文件大小 规格书
26页 722K
描述
1.8-V OPERATIONAL AMPLIFIERS WITH RAIL-TO-RAIL INPUT AND OUTPUT

LMV934IDRE4 技术参数

是否无铅:含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:GREEN, PLASTIC, MS-012AB, SOIC-14针数:14
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.69
Is Samacsys:N放大器类型:OPERATIONAL AMPLIFIER
架构:VOLTAGE-FEEDBACK最大平均偏置电流 (IIB):0.075 µA
25C 时的最大偏置电流 (IIB):0.065 µA标称共模抑制比:78 dB
频率补偿:YES最大输入失调电压:7500 µV
JESD-30 代码:R-PDSO-G14JESD-609代码:e4
长度:8.65 mm低-偏置:NO
低-失调:NO微功率:YES
湿度敏感等级:1负供电电压上限:
标称负供电电压 (Vsup):功能数量:4
端子数量:14最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP14,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
包装方法:TAPE AND REEL峰值回流温度(摄氏度):260
功率:NO电源:1.8/5 V
可编程功率:NO认证状态:Not Qualified
座面最大高度:1.75 mm标称压摆率:0.35 V/us
子类别:Operational Amplifier最大压摆率:0.92 mA
供电电压上限:5.5 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:BICMOS
温度等级:AUTOMOTIVE端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
标称均一增益带宽:1400 kHz最小电压增益:3980
宽带:NO宽度:3.9 mm
Base Number Matches:1

LMV934IDRE4 数据手册

 浏览型号LMV934IDRE4的Datasheet PDF文件第2页浏览型号LMV934IDRE4的Datasheet PDF文件第3页浏览型号LMV934IDRE4的Datasheet PDF文件第4页浏览型号LMV934IDRE4的Datasheet PDF文件第5页浏览型号LMV934IDRE4的Datasheet PDF文件第6页浏览型号LMV934IDRE4的Datasheet PDF文件第7页 
ꢅ ꢒꢓ ꢔꢂ ꢕ ꢖꢊꢗ ꢏꢘ ꢇꢕ ꢈꢏꢀ ꢏꢁ ꢖ ꢀꢇ ꢙꢇ ꢊꢗ ꢆ  
SLOS441F − AUGUST 2004 − REVISED FEBRUARY 2005  
LMV931 . . . DBV (SOT23-5) OR DCK (SC-70) PACKAGE  
(TOP VIEW)  
D
D
1.8-V, 2.7-V, and 5-V Specifications  
Rail-to-Rail Output Swing  
− 600-Load . . . 80 mV From Rail  
− 2-kLoad . . . 30 mV From Rail  
1
2
3
5
4
IN+  
V
CC+  
V
CC−  
IN−  
D
D
D
D
D
V
. . . 200 mV Beyond Rails  
ICR  
OUTPUT  
Gain Bandwidth . . . 1.4 MHz  
Supply Current . . . 100 µA/Amplifier  
Max V . . . 4 mV  
IO  
Space-Saving Packages  
− LMV931: SOT-23 and SC-70  
− LMV932: MSOP and SOIC  
− LMV934: SOIC and TSSOP  
LMV932 . . . D (SOIC) OR  
DGK (VSSOP/MSOP) PACKAGE  
(TOP VIEW)  
1
2
3
4
8
7
6
5
1OUT  
1IN−  
1IN+  
V
CC+  
2OUT  
2IN−  
2IN+  
D
Applications  
− Industrial (Utility/Energy Metering)  
− Automotive  
V
CC−  
− Communications (Optical Telecom,  
Data/Voice Cable Modems)  
− Consumer Electronics (PDAs, PCs,  
CDR/W, Portable Audio)  
− Supply-Current Monitoring  
− Battery Monitoring  
LMV934 . . . D (SOIC) OR PW (TSSOP) PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
1OUT  
1IN−  
1IN+  
4OUT  
4IN−  
4IN+  
V
V
CC+  
CC−  
2IN+  
2IN−  
2OUT  
3IN+  
3IN−  
3OUT  
8
description/ordering information  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
Reel of 2500  
Reel of 250  
Tube of 75  
LMV931IDBVR  
LMV931IDBVT  
LMV931IDCKR  
LMV931IDCKT  
LMV932IDGKR  
LMV932IDGKT  
LMV932ID  
RBB_  
SOT-23 (DBV)  
PREVIEW  
RB_  
Single  
Dual  
SC-70 (DCK)  
PREVIEW  
PREVIEW  
MSOP/VSSOP (DGK)  
SOIC (D)  
−40°C to 125°C  
PREVIEW  
Reel of 2500  
Tube of 50  
LMV932IDR  
LMV934ID  
PREVIEW  
PREVIEW  
SOIC (D)  
Reel of 2500  
Tube of 90  
LMV934IDR  
Quad  
LMV934IPW  
LMV934IPWR  
TSSOP (PW)  
Reel of 2000  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK/DGK: The actual top-side marking has one additional character that designates the assembly/test site.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢘꢨ  
Copyright 2005, Texas Instruments Incorporated  
ꢤ ꢨ ꢥ ꢤꢝ ꢞꢱ ꢠꢟ ꢣ ꢫꢫ ꢩꢣ ꢡ ꢣ ꢢ ꢨ ꢤ ꢨ ꢡ ꢥ ꢒ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

LMV934IDRE4 替代型号

型号 品牌 替代类型 描述 数据表
LMV324MX/NOPB TI

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