LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434G–FEBRUARY 2004–REVISED AUGUST 2005
FEATURES
LMV824 . . . D, DGV, OR PW PACKAGE
•
•
•
•
2.5-V, 2.7-V, and 5-V Performance
(TOP VIEW)
–40°C to 125°C Operation
No Crossover Distortion
1
2
3
4
5
6
7
14 4OUT
1OUT
1IN−
1IN+
13
12
11
10
9
4IN−
4IN+
Low Supply Current at VCC+ = 5 V:
– LMV821…0.3 mA Typ
GND/V
3IN+
V
CC+
CC−
– LMV822…0.5 mA Typ
2IN+
2IN−
3IN−
3OUT
– LMV824…1 mA Typ
8
2OUT
•
•
•
Rail-to-Rail Output Swing
Gain Bandwidth of 5.5 MHz Typ at 5 V
Slew Rate of 1.9 V/µs Typ at 5 V
LMV822 . . . D OR DGK PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
1OUT
1IN −
1IN+
V
CC+
1
2
3
4
8
7
6
5
The LMV821 single, LMV822 dual, and LMV824 quad
devices are low-voltage (2.5 V to 5.5 V), low-power
2OUT
2IN −
2IN+
commodity
operational
amplifiers.
Electrical
GND/V
CC−
characteristics are very similar to the LMV3xx
operational amplifiers (low supply current, rail-to-rail
outputs, input common-mode range that includes
ground). However, the LMV8xx devices offer a higher
bandwidth (5.5 MHz typical) and faster slew rate
(1.9 V/µs typical).
LMV821 . . . DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
IN+
V
CC+
GND/V
The LMV8xx devices are cost-effective solutions for
CC−
applications
requiring
low-voltage/low-power
IN−
OUT
operation and space-saving considerations. The
LMV821 is available in the ultra-small DCK package,
which is approximately half the size of SOT-23-5. The
DCK package saves space on printed circuit boards
and enables the design of small portable electronic
devices (cordless and cellular phones, laptops, PDAs,
PCMIA). It also allows the designer to place the
device closer to the signal source to reduce noise
pickup and increase signal integrity.
The LMV8xx devices are characterized for operation
from –40°C to 85°C. The LMV8xxI devices are
characterized for operation from –40°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.