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LMV822-Q1 PDF预览

LMV822-Q1

更新时间: 2024-11-27 12:21:39
品牌 Logo 应用领域
德州仪器 - TI 运算放大器输出元件
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24页 821K
描述
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

LMV822-Q1 数据手册

 浏览型号LMV822-Q1的Datasheet PDF文件第2页浏览型号LMV822-Q1的Datasheet PDF文件第3页浏览型号LMV822-Q1的Datasheet PDF文件第4页浏览型号LMV822-Q1的Datasheet PDF文件第5页浏览型号LMV822-Q1的Datasheet PDF文件第6页浏览型号LMV822-Q1的Datasheet PDF文件第7页 
LMV821-Q1 is Obsolete  
LMV821-Q1  
LMV822-Q1  
LMV824-Q1  
www.ti.com  
SLOS461F MARCH 2005REVISED JULY 2010  
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS  
Check for Samples: LMV821-Q1, LMV822-Q1, LMV824-Q1  
The LMV82x devices are characterized for operation  
from –40°C to 125°C.  
1
FEATURES  
Qualified for Automotive Applications  
2.5-V, 2.7-V, and 5-V Performance  
–40°C to 125°C Operation  
LMV821...DBV PACKAGE  
(TOP VIEW)  
No Crossover Distortion  
1
2
3
5
4
IN+  
GND/VCC-  
IN-  
VCC+  
Low Supply Current at VCC+ = 5 V  
LMV821: 0.3 mA Typ  
LMV822: 0.5 mA Typ  
LMV824: 1 mA Typ  
OUT  
Rail-to-Rail Output Swing  
LMV822...DGK PACKAGE  
(TOP VIEW)  
Gain Bandwidth of 5.5 MHz Typ at 5 V  
Slew Rate of 1.9 V/µs Typ at 5 V  
1OUT  
1IN-  
VCC+  
1
2
3
4
8
7
6
5
2OUT  
2IN -  
2IN+  
DESCRIPTION/ORDERING INFORMATION  
1IN+  
The LMV821 single, LMV822 dual, and LMV824 quad  
devices are low-voltage (2.5 V to 5.5 V), low-power  
GND/VCC-  
commodity  
operational  
amplifiers.  
Electrical  
LMV824...D OR PW PACKAGE  
(TOP VIEW)  
characteristics are very similar to the LMV3xx  
operational amplifiers (low supply current, rail-to-rail  
outputs, input common-mode range that includes  
ground). However, the LMV82x devices offer a higher  
bandwidth (5.5 MHz typical) and faster slew rate  
(1.9 V/µs typical).  
1OUT  
1
2
3
4
5
6
7
14 4OUT  
1IN-  
1IN+  
VCC+  
4IN–  
13  
12  
11  
10  
9
4IN+  
GND/VCC-  
3IN+  
The LMV82x devices are cost-effective solutions for  
applications  
2IN+  
2IN-  
requiring  
low-voltage/low-power  
operation and space-saving considerations. The  
LMV821 saves space on printed circuit boards and  
enables the design of small portable electronic  
devices (cordless and cellular phones, laptops, PDAs,  
PCMIA). It also allows the designer to place the  
device closer to the signal source to reduce noise  
pickup and increase signal integrity.  
3IN–  
2OUT  
3OUT  
8
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
LMV821QDBVRQ1  
LMV822QDGKRQ1  
LMV824QDRQ1  
TOP-SIDE MARKING(3)  
Single  
Dual  
SOT-23 – DBV  
Reel of 3000  
Reel of 2500  
Reel of 2500  
Reel of 2000  
RB1_  
MSOP/VSSOP – DGK  
SOIC – D  
R8B  
–40°C to 125°C  
LMV824Q  
MV824Q  
Quad  
TSSOP – PW  
LMV824QPWRQ1  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(3) DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2005–2010, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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