LMV710, LMV711, LMV715
SINGLE LOW-POWER RRIO OPERATIONAL AMPLIFIERS
WITH HIGH OUTPUT CURRENT DRIVE AND SHUTDOWN
www.ti.com
SLOS463A–APRIL 2005–REVISED JULY 2005
FEATURES
LMV710
DBV (SOT-23-5) OR DCK (SC-70) PACKAGE
(TOP VIEW)
•
•
•
2.7-V and 5-V Performance
Low Offset Voltage . . . 0.4 mV Typ, 3 mV Max
OUT
1
2
3
V
Input Common-Mode Range . . . 200 mV
Beyond the Rails
5
4
CC+
•
•
•
•
•
•
Rail-to-Rail Swing Into 600 Ω
Gain Bandwidth . . . 5 MHz Typ
Slew Rate . . . 5 V/µs Typ
Turn-On Time From Shutdown . . . <10 µs
Shutdown Current . . . 0.2 µA Typ
Space-Saving Packages
– SOT-23-5/6
V
CC−
+ −
IN+
IN−
LMV711/LMV715
DBV (SOT-23-6) OR DCK (SC-70) PACKAGE
(TOP VIEW)
6 V
OUT 1
CC+
– SC-70
APPLICATIONS
2
5
4
SHUTDOWN
V
−
CC
−
+
•
•
•
•
•
•
•
Wireless Phones, Mobile Phones, PDAs
GSM/TDMA/CDMA Power Amp Control
AGC, RF Power Detectors
Temperature Compensation
Wireless LANs
3
IN+
IN−
Bluetooth
HomeRF
DESCRIPTION/ORDERING INFORMATION
The LMV710, LMV711, and LMV715 are single BiCMOS operational amplifiers designed to meet the demands of
low power, low cost, and small size required by battery-powered portable electronics. These devices have an
input common-mode voltage range that exceeds the rails, rail-to-rail output, and high output-current drive. The
devices offer a bandwidth of 5 MHz and a slew rate of 5 V/µs.
On the LMV711 and LMV715, a separate shutdown pin can be used to disable the device and reduce the supply
current to 0.2 µA typical. The device features a turn-on time of less than 10 µs. It is an ideal solution for
power-sensitive applications, such as cellular phones, pagers, palm computers, etc.
The LMV710I, LMV711I, and LMV715I are characterized for operation from –40°C to 85°C.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
LMV710IDBVR
TOP-SIDE MARKING(2)
RB4_
SOT-23-5 – DBV
SC-70 – DCK
Reel of 3000
Reel of 3000
Reel of 3000
Reel of 3000
Reel of 3000
Reel of 3000
LMV710IDCKR
LMV711IDBVR
LMV711IDCKR
LMV715IDBVR
LMV715IDCKR
RE_
RB5_
RF_
SOT-23-6 – DBV
SC-70 – DCK
–40°C to 85°C
SOT-23-6 – DBV
SC-70 – DCK
4B9_
RL_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.