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LMV341-Q1_15 PDF预览

LMV341-Q1_15

更新时间: 2024-11-20 01:19:11
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德州仪器 - TI 放大器输出元件
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描述
RAIL-TO-RAIL OUTPUT CMOS OPERATIONAL AMPLIFIERS

LMV341-Q1_15 数据手册

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LMV341-Q1  
LMV344-Q1  
www.ti.com.............................................................................................................................................................. SGLS342CJULY 2006REVISED JUNE 2009  
RAIL-TO-RAIL OUTPUT CMOS OPERATIONAL AMPLIFIERS  
1
FEATURES  
Qualified for Automotive Applications  
Low Supply Current: 100 µA Typ  
Gain Bandwidth: 1 MHz Typ  
2.7-V and 5-V Performance  
Rail-to-Rail Output Swing  
Slew Rate: 1 V/µs Typ  
Input Bias Current: 1 pA Typ  
Input Offset Voltage: 0.25 mV Typ  
Turn-On Time From Shutdown: 5 µs Typ  
Input Referred Voltage Noise (at 10 kHz):  
20 nV/Hz  
LMV341  
DBV OR DCK PACKAGE  
(TOP VIEW)  
LMV344  
PW PACKAGE  
(TOP VIEW)  
1
2
3
6
5
4
IN+  
GND  
IN–  
V+  
1
2
3
4
5
6
7
14 4OUT  
1OUT  
1IN-  
1IN+  
V+  
13  
12  
11  
10  
9
4IN-  
SHDN  
OUT  
4IN+  
GND  
3IN+  
3IN-  
2IN+  
2IN-  
2OUT  
8
3OUT  
DESCRIPTION/ORDERING INFORMATION  
The LMV341 and LMV344 devices are single and quad CMOS operational amplifiers, respectively, with low  
voltage, low power, and rail-to-rail output swing capabilities. The PMOS input stage offers an ultra-low input bias  
current of 1 pA (typ) and an offset voltage of 0.25 mV (typ). The single supply amplifier is designed specifically  
for low-voltage (2.7 V to 5 V) operation, with a wide common-mode input voltage range that typically extends  
from –0.2 V to 0.8 V from the positive supply rail. Additional features are a 20-nV/Hz voltage noise at 10 kHz,  
1-MHz unity-gain bandwidth, 1-V/µs slew rate, and 100-µA current consumption per channel.  
An extended industrial temperature range from –40°C to 125°C makes this device suitable for automotive  
applications.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
LMV341QDCKRQ1  
TOP-SIDE MARKING(3)  
RR_  
SC-70 – DCK  
SOT-23 – DBV  
TSSOP – PW  
Reel of 3000  
–40°C to 125°C  
Reel of 3000  
Reel of 2000  
LMV341QDBVRQ1  
RCH_  
LMV344IPWRQ1  
LMV344Q  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006–2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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