LMV341-Q1
LMV344-Q1
www.ti.com.............................................................................................................................................................. SGLS342C–JULY 2006–REVISED JUNE 2009
RAIL-TO-RAIL OUTPUT CMOS OPERATIONAL AMPLIFIERS
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FEATURES
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Qualified for Automotive Applications
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Low Supply Current: 100 µA Typ
Gain Bandwidth: 1 MHz Typ
2.7-V and 5-V Performance
Rail-to-Rail Output Swing
Slew Rate: 1 V/µs Typ
Input Bias Current: 1 pA Typ
Input Offset Voltage: 0.25 mV Typ
Turn-On Time From Shutdown: 5 µs Typ
Input Referred Voltage Noise (at 10 kHz):
20 nV/√Hz
LMV341
DBV OR DCK PACKAGE
(TOP VIEW)
LMV344
PW PACKAGE
(TOP VIEW)
1
2
3
6
5
4
IN+
GND
IN–
V+
1
2
3
4
5
6
7
14 4OUT
1OUT
1IN-
1IN+
V+
13
12
11
10
9
4IN-
SHDN
OUT
4IN+
GND
3IN+
3IN-
2IN+
2IN-
2OUT
8
3OUT
DESCRIPTION/ORDERING INFORMATION
The LMV341 and LMV344 devices are single and quad CMOS operational amplifiers, respectively, with low
voltage, low power, and rail-to-rail output swing capabilities. The PMOS input stage offers an ultra-low input bias
current of 1 pA (typ) and an offset voltage of 0.25 mV (typ). The single supply amplifier is designed specifically
for low-voltage (2.7 V to 5 V) operation, with a wide common-mode input voltage range that typically extends
from –0.2 V to 0.8 V from the positive supply rail. Additional features are a 20-nV/√Hz voltage noise at 10 kHz,
1-MHz unity-gain bandwidth, 1-V/µs slew rate, and 100-µA current consumption per channel.
An extended industrial temperature range from –40°C to 125°C makes this device suitable for automotive
applications.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
LMV341QDCKRQ1
TOP-SIDE MARKING(3)
RR_
SC-70 – DCK
SOT-23 – DBV
TSSOP – PW
Reel of 3000
–40°C to 125°C
Reel of 3000
Reel of 2000
LMV341QDBVRQ1
RCH_
LMV344IPWRQ1
LMV344Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.