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LMV324QDG4 PDF预览

LMV324QDG4

更新时间: 2024-11-04 05:42:27
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路光电二极管输出元件
页数 文件大小 规格书
37页 1135K
描述
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

LMV324QDG4 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:SOIC
包装说明:SOIC-14针数:14
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01Factory Lead Time:6 weeks
风险等级:5.03Is Samacsys:N
放大器类型:OPERATIONAL AMPLIFIER架构:VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB):0.25 µA25C 时的最大偏置电流 (IIB):0.25 µA
最小共模抑制比:50 dB标称共模抑制比:65 dB
频率补偿:YES最大输入失调电流 (IIO):0.05 µA
最大输入失调电压:7000 µVJESD-30 代码:R-PDSO-G14
JESD-609代码:e4长度:8.65 mm
低-偏置:NO低-失调:NO
微功率:YES湿度敏感等级:1
功能数量:4端子数量:14
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP14,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE包装方法:TUBE
峰值回流温度(摄氏度):260功率:NO
电源:3/5 V可编程功率:NO
认证状态:Not Qualified座面最大高度:1.75 mm
标称压摆率:1 V/us子类别:Operational Amplifier
最大压摆率:0.208 mA供电电压上限:5.5 V
标称供电电压 (Vsup):2.7 V表面贴装:YES
技术:BIPOLAR温度等级:AUTOMOTIVE
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED标称均一增益带宽:1000 kHz
最小电压增益:10000宽带:NO
宽度:3.9 mmBase Number Matches:1

LMV324QDG4 数据手册

 浏览型号LMV324QDG4的Datasheet PDF文件第2页浏览型号LMV324QDG4的Datasheet PDF文件第3页浏览型号LMV324QDG4的Datasheet PDF文件第4页浏览型号LMV324QDG4的Datasheet PDF文件第5页浏览型号LMV324QDG4的Datasheet PDF文件第6页浏览型号LMV324QDG4的Datasheet PDF文件第7页 
LMV321 SINGLE, LMV358 DUAL  
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN  
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS  
www.ti.com  
SLOS263TAUGUST 1999REVISED SEPTEMBER 2007  
1
FEATURES  
LMV324 . . . D (SOIC) OR PW (TSSOP) PACKAGE  
2.7-V and 5-V Performance  
(TOP VIEW)  
–40°C to 125°C Operation  
Low-Power Shutdown Mode (LMV324S)  
No Crossover Distortion  
1
4OUT  
13 4IN–  
12 4IN+  
11 GND  
10 3IN+  
1OUT  
1IN–  
1IN+  
14  
2
3
4
5
6
7
Low Supply Current  
V
CC+  
LMV321 . . . 130 μA Typ  
LMV358 . . . 210 μA Typ  
LMV324 . . . 410 μA Typ  
LMV324S . . . 410 μA Typ  
2IN+  
2IN–  
9
8
3IN–  
3OUT  
2OUT  
Rail-to-Rail Output Swing  
LMV324S . . . D (SOIC) OR PW (TSSOP) PACKAGE  
(TOP VIEW)  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
1000-V Charged-Device Model (C101)  
1OUT  
1IN–  
1IN+  
1
2
3
4
5
6
7
8
16 4OUT  
15  
14  
13  
12  
11  
10  
9
4IN–  
4IN+  
DESCRIPTION/  
ORDERING INFORMATION  
V
CC  
GND  
2IN+  
2IN–  
3IN+  
The LMV321, LMV358, and LMV324/LMV324S are  
single, dual, and quad low-voltage (2.7 V to 5.5 V)  
operational amplifiers with rail-to-rail output swing.  
The LMV324S, which is a variation of the standard  
LMV324, includes a power-saving shutdown feature  
that reduces supply current to a maximum of 5 μA  
per channel when the amplifiers are not needed.  
Channels 1 and 2 together are put in shutdown, as  
are channels 3 and 4. While in shutdown, the outputs  
actively are pulled low.  
3IN–  
2OUT  
3OUT  
3/4 SHDN  
1/2 SHDN  
LMV358 . . . D (SOIC), DDU (VSSOP),  
DGK (MSOP), OR PW (TSSOP) PACKAGE  
(TOP VIEW)  
1
1OUT  
1IN–  
1IN+  
GND  
V
CC+  
8
7
6
5
2
3
4
2OUT  
2IN–  
2IN+  
The LMV321, LMV358, LMV324, and LMV324S are  
the most cost-effective solutions for applications  
where low-voltage operation, space saving, and low  
cost are needed. These amplifiers are designed  
specifically for low-voltage (2.7 V to 5 V) operation,  
with performance specifications meeting or exceeding  
the LM358 and LM324 devices that operate from 5 V  
to 30 V. Additional features of the LMV3xx devices  
LMV321 . . . DBV (SOT-23) OR DCK (SC-70) PACKAGE  
(TOP VIEW)  
1
2
3
5
1IN+  
GND  
1IN–  
V
CC+  
are  
a common-mode input voltage range that  
includes ground, 1-MHz unity-gain bandwidth, and  
1-V/μs slew rate.  
4
OUT  
The LMV321 is available in the ultra-small DCK  
(SC-70) package, which is approximately one-half the  
size of the DBV (SOT-23) package. This package  
saves space on printed circuit boards and enables  
the design of small portable electronic devices. It also  
allows the designer to place the device closer to the  
signal source to reduce noise pickup and increase  
signal integrity.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

LMV324QDG4 替代型号

型号 品牌 替代类型 描述 数据表
LMV324QD TI

完全替代

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