Datasheet > LMH6321TS

LMH6321TS

更新时间： 2024-09-15 04:19:59

品牌	Logo	应用领域
美国国家半导体 - NSC		/
页数	文件大小	规格书
2页	24K
描述
VP Quality

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中文翻译

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数据手册
替代型号

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LMH6321TS 数据手册

Company

URL for Additional Information

National Semiconductor

http://www.national.com/quality/green/

Contact

Title

Phone

Gerry Fields

Green.project@nsc.com

VP Quality

1-408-721-8435

Part Number

MSL Rating

Peak Body Temp C

MaxTime (Sec)

Cycles

LMH6321TS

235

Document Date

Weight (mg)

Unit Type

This part number contains Lead(Pb) and is NOT RoHS Compliant.

9-Sep-2006

1,609.822

Each

Homogeneous Material Composition Declaration for Electronic Products

Item

Weight (mg)

947.510 Cu

Component

CAS#

Weight (mg)

946.032

ppm

998,440

Leadframe

7440-50-8

7440-31-5

7723-14-0

1.421

0.057

438.225

170.246

16.394

5.675

9.996

1.764

8.350

0.050

0.000

6.170

3.257

0.085

0.068

1.520

0.512

1,500

Plastic

630.540 SiO2

60676-86-0

25928-94-3

1309-64-4

40039-93-8

7440-31-5

7439-92-1

7440-21-3

7429-90-5

7440-38-2

7440-42-8

7440-56-4

7723-14-0

7440-36-0

7440-02-0

7439-92-1

7440-22-4

7440-31-5

7440-22-4

7440-57-5 or 7440-50-8

695,000

270,000

26,000

9,000

850,000

150,000

994,000

6,000

Epoxy Resin

Sb2O3

Brominated Epoxy

Ext. LeadFinish

Chip

11.760 Sn

8.400 Si

As (dopant)

B (dopant)

Ge (dopant)

P (dopant)

Sb (dopant)

Lead Plating

Die Attach

6.170 Ni

1,000,000

955,000

25,000

20,000

1,000,000

3.410 Pb

Int. LeadFinish

Wires

1.520 Ag

0.512 Au or Cu

Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical

testing. Additionally, the following should be noted:

1. One or more dopant materials may be present in the silicon die to provide semiconductor properties.The amounts are very small and estimated

as listed.

2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary.

3. Brominated epoxy resins listed are generic and may or may not be the specific chemical used. The identity of the compound used is

proprietary, however National certifies that these brominated compounds are not PBB or PBDE's, which are banned.

4. The die attach, if present, does not contain any flame retardant.

National Semiconductor

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LMH6321TS 替代型号

型号	品牌	替代类型	描述	数据表
LMH6321TS/NOPB	TI	功能相似	具有可调节电流限制的 300mA 高速缓冲器 \| KTW \| 7 \| -40 to 125

与LMH6321TS相关器件

型号	品牌	获取价格	描述	数据表
LMH6321TS/NOPB	NSC	获取价格	IC BUFFER AMPLIFIER, PSSO7, TO-263, 7 PIN, Buffer Amplifier
LMH6321TS/NOPB	TI	获取价格	具有可调节电流限制的 300mA 高速缓冲器 \| KTW \| 7 \| -40 to 125
LMH6321TSX	NSC	获取价格	300 mA High Speed Buffer with Adjustable Current Limit
LMH6321TSX/NOPB	TI	获取价格	具有可调节电流限制的 300mA 高速缓冲器 \| KTW \| 7 \| -40 to 125
LMH6401	TI	获取价格	4.5GHz 超宽带数字可变增益放大器
LMH6401IRMZR	TI	获取价格	4.5GHz 超宽带数字可变增益放大器 \| RMZ \| 16 \| -40 to 85
LMH6401IRMZT	TI	获取价格	4.5GHz 超宽带数字可变增益放大器 \| RMZ \| 16 \| -40 to 85
LMH6502	NSC	获取价格	Wideband, Low Power, Linear-in-dB Variable Gain Amplifier
LMH6502	TI	获取价格	宽带、低功耗、dB 线性可变增益放大器
LMH6502_15	TI	获取价格	LMH6502 Wideband, Low Power, Linear-in-dB Variable Gain Amplifier

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