是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | MICRO ARRAY-36 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.09 | Is Samacsys: | N |
JESD-30 代码: | S-PBGA-B36 | JESD-609代码: | e1 |
长度: | 3.5 mm | 湿度敏感等级: | 1 |
端子数量: | 36 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装等效代码: | BGA36,6X6,20 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
电源: | 1.8 V | 认证状态: | Not Qualified |
座面最大高度: | 1.1 mm | 子类别: | Other Microprocessor ICs |
最大压摆率: | 3 mA | 最大供电电压: | 1.98 V |
最小供电电压: | 1.62 V | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 宽度: | 3.5 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LM8322JGR8/NOPB | TI |
获取价格 |
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA36, ROHS COMPLIANT, MICRO ARRAY-36 | |
LM8322JGR8X | NSC |
获取价格 |
Mobile I/O Companion Supporting Key-Scan, I/O Expansion, PWM, and ACCESS.bus Host Interfac | |
LM8322JGR8X/NOPB | TI |
获取价格 |
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA36, ROHS COMPLIANT, MICRO ARRAY-36 | |
LM8322JGR8X/NOPB | NSC |
获取价格 |
IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA36, ROHS COMPLIANT, MICRO ARRAY-36, Microprocesso | |
LM8323 | TI |
获取价格 |
LM8323 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In | |
LM8325-1 | TI |
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LM8325-1 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host | |
LM8325-1GRA25A | TI |
获取价格 |
IC SPECIALTY CONSUMER CIRCUIT, PBGA25, MICRO ARRAY PACKAGE-25, Consumer IC:Other | |
LM8327 | TI |
获取价格 |
LM8327 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In | |
LM8327JGR8 | TI |
获取价格 |
LM8327 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In | |
LM8327JGR8X | TI |
获取价格 |
LM8327 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In |