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LM725CH/NOPB PDF预览

LM725CH/NOPB

更新时间: 2024-11-23 19:19:47
品牌 Logo 应用领域
德州仪器 - TI 放大器
页数 文件大小 规格书
13页 638K
描述
OP-AMP, 3500uV OFFSET-MAX, 1MHz BAND WIDTH, MBCY8, METAL CAN-8

LM725CH/NOPB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BCY
包装说明:, CAN8,.2针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.35
放大器类型:OPERATIONAL AMPLIFIER架构:VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB):0.125 µA25C 时的最大偏置电流 (IIB):0.125 µA
最小共模抑制比:115 dB标称共模抑制比:115 dB
频率补偿:NO最大输入失调电压:3500 µV
JESD-30 代码:O-MBCY-W8JESD-609代码:e1
低-失调:NO湿度敏感等级:1
负供电电压上限:-22 V标称负供电电压 (Vsup):-15 V
功能数量:1端子数量:8
最高工作温度:70 °C最低工作温度:
封装主体材料:METAL封装等效代码:CAN8,.2
封装形状:ROUND封装形式:CYLINDRICAL
峰值回流温度(摄氏度):260电源:+-15 V
认证状态:Not Qualified标称压摆率:0.2 V/us
子类别:Operational Amplifier供电电压上限:22 V
标称供电电压 (Vsup):15 V表面贴装:NO
技术:BIPOLAR温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:WIRE
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
标称均一增益带宽:1000 kHz最小电压增益:250000
Base Number Matches:1

LM725CH/NOPB 数据手册

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OBSOLETE  
LM725  
www.ti.com  
SNOS552D MAY 1998REVISED APRIL 2013  
LM725 Operational Amplifier  
Check for Samples: LM725  
1
FEATURES  
DESCRIPTION  
The  
LM725/LM725A/LM725C  
are  
operational  
2
High Open Loop Gain: 3,000,000  
Low Input Voltage Drift 0.6 μV/°C  
High Common Mode Rejection 120 dB  
Low Input Noise Current 0.15 pA/Hz  
Low Input Offset Current 2 nA  
High Input Voltage Range ±14V  
Wide Power Supply Range ±3V to ±22V  
Offset Null Capability  
amplifiers featuring superior performance in  
applications where low noise, low drift, and accurate  
closed-loop gain are required. With high common  
mode rejection and offset null capability, it is  
especially suited for low level instrumentation  
applications over a wide supply voltage range.  
The LM725A has tightened electrical performance  
with higher input accuracy and like the LM725, is  
guaranteed over a 55°C to +125°C temperature  
range.  
The  
LM725C  
has  
slightly  
relaxed  
Output Short Circuit Protection  
specifications and has its performance guaranteed  
over a 0°C to 70°C temperature range.  
TYPICAL APPLICATIONS  
CONNECTION DIAGRAM  
Metal Can Package  
Figure 1. Thermocouple Amplifier  
Dual-In-Line Package  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1998–2013, Texas Instruments Incorporated  

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