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LM4865MWC PDF预览

LM4865MWC

更新时间： 2024-11-09 13:09:23
品牌 Logo 应用领域
德州仪器 - TI 开关音频控制集成电路消费电路商用集成电路放大器功率放大器光电二极管PC
页数 文件大小 规格书
25页 1373K
描述
1 CHANNEL(S), VOLUME CONTROL CIRCUIT, UUC, WAFER

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中文翻译

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LM4865MWC 技术参数

生命周期：Obsolete零件包装代码：WAFER
包装说明：DIE,Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：5.35商用集成电路类型：VOLUME CONTROL CIRCUIT
JESD-30 代码：X-XUUC-N信道数量：1
功能数量：1最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：UNSPECIFIED
封装代码：DIE封装形状：UNSPECIFIED
封装形式：UNCASED CHIP认证状态：Not Qualified
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：2.7 V
表面贴装：YES温度等级：INDUSTRIAL
端子形式：NO LEAD端子位置：UPPER
Base Number Matches：1

LM4865MWC 数据手册

 浏览型号LM4865MWC的Datasheet PDF文件第2页浏览型号LM4865MWC的Datasheet PDF文件第3页浏览型号LM4865MWC的Datasheet PDF文件第4页浏览型号LM4865MWC的Datasheet PDF文件第5页浏览型号LM4865MWC的Datasheet PDF文件第6页浏览型号LM4865MWC的Datasheet PDF文件第7页 
LM4865  
www.ti.com  
SNAS035G –DECEMBER 1999–REVISED MAY 2013  
LM4865  
750 mW Audio Power Amplifier with DC Volume  
Control and Headphone Switch  
Check for Samples: LM4865  
1
FEATURES  
DESCRIPTION  
The LM4865 is a mono bridged audio power amplifier  
with DC voltage volume control. The LM4865 is  
capable of delivering 750mW of continuous average  
power into an 8Ω load with less than 1% THD when  
powered by a 5V power supply. Switching between  
bridged speaker mode and headphone (single ended)  
mode is accomplished using the headphone sense  
pin. To conserve power in portable applications, the  
LM4865's micropower shutdown mode (IQ = 0.7µA,  
typ) is activated when less than 300mV is applied to  
the DC Vol/SD pin.  
2
•
•
•
•
DC Voltage Volume Control  
Headphone Amplifier Mode  
“Click and Pop” Suppression  
Shutdown Control When Volume Control Pin Is  
Low  
•
Thermal Shutdown Protection  
APPLICATIONS  
•
GSM Phones and Accessories, DECT, Office  
Phones  
Boomer audio power amplifiers are designed  
specifically to provide high power audio output while  
maintaining high fidelity. They require few external  
components and operate on low supply voltages.  
•
•
Hand Held Radio  
Other Portable Audio Devices  
KEY SPECIFICATION  
•
PO at 1.0% THD+N Into 8Ω SOIC, Micro SMD  
750 mW (typ)  
•
PO at 10% THD+N Into 8Ω SOIC, Micro SMD 1W  
(typ)  
•
•
Shutdown Current 0.7µA(typ)  
Supply Voltage Range 2.7V to 5.5 V  
CONNECTION DIAGRAMS  
Figure 1. Micro SMD Package (Top View)  
Figure 2. Small Outline Package (SOIC) (Top View)  
Mini Small Outline Package (VSSOP)  
See Package Number D, DGK  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1999–2013, Texas Instruments Incorporated  
1234567...25

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