是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | MICRO-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.1 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 8658 |
Samacsys Pin Count: | 8 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Small Outline Packages | Samacsys Footprint Name: | MICRO8 CASE 846A-02 ISSUE H |
Samacsys Released Date: | 2015-10-26 01:49:06 | Is Samacsys: | N |
放大器类型: | OPERATIONAL AMPLIFIER | 架构: | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB): | 0.5 µA | 25C 时的最大偏置电流 (IIB): | 0.25 µA |
最小共模抑制比: | 65 dB | 标称共模抑制比: | 70 dB |
频率补偿: | NO | 最大输入失调电流 (IIO): | 0.05 µA |
最大输入失调电压: | 7000 µV | JESD-30 代码: | S-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 3 mm |
低-偏置: | NO | 低-失调: | NO |
微功率: | NO | 湿度敏感等级: | 1 |
功能数量: | 2 | 端子数量: | 8 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP8,.19 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 包装方法: | TR |
峰值回流温度(摄氏度): | 260 | 功率: | NO |
电源: | +-1.5/+-15/3/30 V | 可编程功率: | NO |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
子类别: | Operational Amplifier | 最大压摆率: | 3 mA |
供电电压上限: | 32 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | BIPOLAR |
温度等级: | COMMERCIAL | 端子面层: | Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
最小电压增益: | 15000 | 宽带: | NO |
宽度: | 3 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
LM2904DGKR | TI |
功能相似 |
DUAL OPERATIONAL AMPLIFIERS | |
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DUAL OPERATIONAL AMPLIFIERS | |
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型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LM358DP | NXP |
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IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, 3 MM, PLASTIC, SOT-505-1, TSS | |
LM358DP3 | TI |
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IC,OP-AMP,DUAL,BIPOLAR,SOP,8PIN,PLASTIC | |
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LM358DRG3 | ROCHESTER |
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LM358DRG3 | TI |
获取价格 |
DUAL OPERATIONAL AMPLIFIERS |