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LM2502 PDF预览

LM2502

更新时间: 2024-11-13 21:54:23
品牌 Logo 应用领域
美国国家半导体 - NSC /
页数 文件大小 规格书
27页 1084K
描述
Mobile Pixel Link (MPL) Display Interface Serializer and Deserializer

LM2502 数据手册

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August 2005  
LM2502  
Mobile Pixel Link (MPL) Display Interface Serializer and  
Deserializer  
General Description  
Features  
>
n
300 Mbps Dual Link Raw Throughput  
The LM2502 device is a dual link display interface SERDES  
that adapts existing CPU / video busses to a low power  
current-mode serial MPL link. The chipset may also be used  
for a RGB565 application with glue logic. The interconnect is  
reduced from 22 signals to only 3 active signals with the  
LM2502 chipset easing flex interconnect design, size and  
cost.  
n MPL Physical Layer (MPL-0)  
n Pin selectable Master / Slave mode  
n Frequency Reference Transport  
n Complete LVCMOS / MPL Translation  
n Interface Modes:  
— 16-bit CPU, i80 or m68 style  
— RGB565 with glue logic  
n −30˚C to 85˚C Operating Range  
n Link power down mode reduces IDDZ 10 µA  
n Dual Display Support (CS1* & CS2*)  
n Via-less MPL interconnect feature  
n 3.0V Supply Voltage (VDD and VDDA  
n Interfaces to 1.7V to 3.3V Logic (VDDIO  
The Master Serializer (SER) resides beside an application  
processor or baseband processor and translates a parallel  
bus from LVCMOS levels to serial MPL levels for transmis-  
sion over a flex cable and PCB traces to the Slave Deseri-  
alizer (DES) located near the display module.  
<
Dual display support is provided for a primary and sub  
display through the use of two ChipSelect signals. A Mode  
pin selects either a i80 or m68 style interface.  
)
)
The Power_Down (PD*) input controls the power state of the  
MPL interface. When PD* is asserted, the MD1/0 and MC  
signals are powered down to save current.  
System Benefits  
n Small Interface  
n Low Power  
n Low EMI  
n Frequency Reference Transport  
n Intrinsic Level Translation  
The LM2502 implements the physical layer of the MPL Stan-  
dard (MPL-0). The LM2502 is offered in NOPB (Lead-free)  
UFBGA and LLP packages.  
Typical Application Diagram  
20093301  
Ordering Information  
NSID  
Package Type  
Package ID  
49 Lead UFBGA style, 4.0 X 4.0 X 1.0 mm, 0.5 mm pitch  
1000 std reel, LM2502SMX 4500 reel  
LM2502SM  
LM2502SQ  
SLH49A  
SQF40A  
40 Lead LLP style, 5.0 X 5.0 X 0.8 mm, 0.4 mm pitch  
1000 std reel, LM2502SQX 4500 reel  
© 2005 National Semiconductor Corporation  
DS200933  
www.national.com  

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