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LM2501

更新时间: 2024-01-16 00:21:05
品牌 Logo 应用领域
美国国家半导体 - NSC /
页数 文件大小 规格书
14页 300K
描述
Mobile Pixel Link (MPL) Camera Interface Serializer and Deserializer

LM2501 技术参数

生命周期:Obsolete零件包装代码:QFN
包装说明:VQCCN,针数:24
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.84
差分输出:NO驱动器位数:1
输入特性:STANDARD接口集成电路类型:LINE TRANSCEIVER
接口标准:GENERAL PURPOSEJESD-30 代码:R-XQCC-N24
长度:4.5 mm功能数量:1
端子数量:24最高工作温度:70 °C
最低工作温度:封装主体材料:UNSPECIFIED
封装代码:VQCCN封装形状:RECTANGULAR
封装形式:CHIP CARRIER, VERY THIN PROFILE认证状态:Not Qualified
接收器位数:1座面最大高度:0.6 mm
最大供电电压:3.1 V最小供电电压:2.9 V
标称供电电压:3 V表面贴装:YES
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
宽度:3.5 mmBase Number Matches:1

LM2501 数据手册

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ADVANCE INFORMATION  
June 2004  
LM2501  
Mobile Pixel Link (MPL) Camera Interface Serializer and  
Deserializer  
General Description  
Features  
n 160 Mbps Raw Throughput  
The LM2501 device is a Serializer/Deserializer that adapts  
existing video busses to Mobile Pixel Link (MPL). MPL is  
intended to replace wide LVCMOS video interfaces inside  
portable electronics equipment benefiting their cost, size,  
EMI and power consumption.  
n MPL-0 Meets MPL Physical Layer Specification  
n Configurable as a Serializer or Deserializer  
n Complete LVCMOS to MPL Translation  
n Serializes 8-bit Camera Interface  
— 8-bit color data  
— plus VSYNC and HSYNC bits  
n Link power down mode reduces quiescent power under  
10 µA (actual TBD)  
By using the LM2501 SERDES chipset, the interconnect is  
reduced from 12 active signals to only 3 active signals  
providing a 75% reduction. This eases interconect and flex  
design, size and cost.  
Contained in a 24 lead Ultra Thin CSP Package, the Serial-  
izer resides beside the video source (camera) and translates  
the parallel bus from LVCMOS levels to serial MPL levels for  
transmission over a flex cable to the Deserializer located by  
the respective destination Video Input Port.  
n 1.7V–3.1V and 2.9-3.1V Supply Voltage  
n Interfaces to 1.8V–3.0V Logic  
n Offered in a small 24L UCSP Package  
— 3.5 mm X 4.5 mm  
— 0.6 mm Max Height  
An extra clock transport is provided to deliver a clock signal  
to the target. For example, from the main board to the flip  
board where the camera module is located. Transmission of  
the clock also benefits from MPL’s low power transmission  
and low EMI.  
System Benefits  
n Reduced Wire Interface  
n Low Power  
n Low EMI  
n Extra Clock Transport  
n Intrinsic Level Translation  
The Power_Down (PD*) input controls the power state of the  
MPL interface. When PD* is asserted, the MD, MC and WC  
signals are powered down to save current and reduce power  
dissipation.  
Typical Application Diagram  
20091601  
Ordering Information  
NSID  
Package Type  
24-Lead Ultra Thin CSP 3.5 X 4.5 X 0.6 mm  
Package ID  
LM2501SL  
SLE24A  
I2C® is a registered trademark of Phillips Corporation.  
© 2004 National Semiconductor Corporation  
DS200916  
www.national.com  

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