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LM13700MDC PDF预览

LM13700MDC

更新时间: 2024-09-20 13:00:43
品牌 Logo 应用领域
德州仪器 - TI 二极管运算放大器放大器电路光电二极管
页数 文件大小 规格书
32页 2031K
描述
DUAL OP-AMP, 4000uV OFFSET-MAX, UUC, DIE

LM13700MDC 技术参数

生命周期:Obsolete零件包装代码:DIE
包装说明:DIE,Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.33.00.01
风险等级:5.68放大器类型:OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB):8 µA标称共模抑制比:110 dB
最大输入失调电压:4000 µVJESD-30 代码:X-XUUC-N
负供电电压上限:-18 V标称负供电电压 (Vsup):-15 V
功能数量:2最高工作温度:70 °C
最低工作温度:封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:UNSPECIFIED
封装形式:UNCASED CHIP认证状态:Not Qualified
标称压摆率:50 V/us子类别:Operational Amplifier
供电电压上限:18 V标称供电电压 (Vsup):15 V
表面贴装:YES技术:BIPOLAR
温度等级:COMMERCIAL端子形式:NO LEAD
端子位置:UPPERBase Number Matches:1

LM13700MDC 数据手册

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LM13700  
www.ti.com  
SNOSBW2E NOVEMBER 1999REVISED MARCH 2013  
LM13700 Dual Operational Transconductance Amplifiers with Linearizing Diodes and  
Buffers  
Check for Samples: LM13700  
1
FEATURES  
DESCRIPTION  
The LM13700 series consists of two current  
controlled transconductance amplifiers, each with  
differential inputs and a push-pull output. The two  
amplifiers share common supplies but otherwise  
operate independently. Linearizing diodes are  
provided at the inputs to reduce distortion and allow  
higher input levels. The result is a 10 dB signal-to-  
noise improvement referenced to 0.5 percent THD.  
High impedance buffers are provided which are  
especially designed to complement the dynamic  
range of the amplifiers. The output buffers of the  
LM13700 differ from those of the LM13600 in that  
their input bias currents (and hence their output DC  
levels) are independent of IABC. This may result in  
performance superior to that of the LM13600 in audio  
applications.  
2
gm Adjustable over 6 Decades  
Excellent gm Linearity  
Excellent Matching between Amplifiers  
Linearizing Diodes  
High Impedance Buffers  
High Output Signal-to-Noise Ratio  
APPLICATIONS  
Current-Controlled Amplifiers  
Current-Controlled Impedances  
Current-Controlled Filters  
Current-Controlled Oscillators  
Multiplexers  
Timers  
Sample-and-Hold circuits  
Connection Diagram  
Figure 1. PDIP and SOIC Packages-Top View  
See Package Number D0016A or NFG0016E  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1999–2013, Texas Instruments Incorporated  

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