Datasheet > LM1265HPR68MGD

LM1265HPR68MGD

更新时间： 2024-09-24 02:43:27

品牌	Logo	应用领域
雷卯电子 - LEIDITECH		/
页数	文件大小	规格书
6页	1042K
描述
Carbonyl Powder

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中文翻译

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数据手册

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LM1265HPR68MGD 数据手册

LM1265H-Series(G)-D

1. Features

1. Carbonyl Powder.

2. Compact design.

Halogen

3. High current，low DCR，high efficiency.

4. Very low acoustic noise and very low leakage flux noise.

5. High reliability.

Pb-free

Halogen-free

6. 100% Lead(Pb)-Free and RoHS compliant.

7. AEC-Q200 Grade 1 qualified (–40℃ to +125℃ ambient)

2. Applications

Note PC power system，incl. IMVP-6

DC/DC converter .

3. Dimensions

330

1150

leadframe

Recommend PC Board Pattern

1R5

1150

non-leadframe

Series

LM1265HP

Type

A(mm)

A'(mm)

B(mm)

C(mm)

D(mm)

E(mm)

4.7±0.3

L(mm) G(mm) H(mm)

14.2

8.0

5.0

leadframe

Note: 1. The above PCB layout reference only.

2. Recommend solder paste thickness

at 0.15mm and above.

13.5±0.5 12.5±0.3 12.5±0.3 6.2±0.3

2.3±0.3

non-leadframe

4. Part Numbering

1265

330

A: Series

B: Dimension

C: Type

BxC

HP:H:Carbonyl Powder,P:PAD broaden.

D: Inductance

E: Inductance Tolerance

330=33uH

M=±20%.

F: 印 D/C

印字:黑色.330 及 D/C 1150 (11 年,50 週期)(依實際生產日期而定)

1/6

Rev 2.0 :12.01.2019

www.leiditech.com

12 3 4 5 6

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