CHENMKO ENTERPRISE CO.,LTD
LL245PT
SURFACE MOUNT
FAST SWITCHING DIODE
VOLTAGE RANGE 250 Volts CURRENT 200 mAmpere
FEATURES
* For surface mounted applications
* Low profile package
* Built-in strain relief
* Low power loss, high efficiency
* High current capability, low forward voltage drop
* Power dissipation: 300mW
Mini-Melf
* Repetitive peak forward current: 625mA
* High temperature soldering guaranteed :
260oC/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC Mini Melf molded plastic
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
CATHODE BAND
0.4
0.4
Polarity: Color band denotes cathode end
(2)
(1)
+0.2
3.4
0.1
1.5Max.
CIRCUIT
(2)
(1)
Dimensions in millimeters
MAXIMUM RATINGES ( At TA = 25oC unless otherwise noted )
RATINGS
SYMBOL
VRRM
UNITS
Volts
LL245PT
Maximum Recurrent Peak Reverse Voltage
250
141
200
200
Maximum RMS Voltage
VRMS
VDC
IO
Volts
Volts
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current at TL = 100oC
mAmps
@ t=1.0uS
Non-Repetitive Peak Forward Surge Current
@ t=1.0S
4.0
1.0
3.0
IFSM
Amps
Typic Junction Capacitance (Note 2)
Maximum Reverse Recovery Time (Note 3)
Typical Thermal Resistance (Note 1)
Storage and Operating Temperature Range
CJ
pF
nS
TRR
75
625
R
JA
oC / W
oC
TJ, TSTG
-65 to +175
ELECTRICAL CHARACTERISTICS ( At TA = 25oC unless otherwise noted )
CHARACTERISTICS
SYMBOL
UNITS
Volts
LL245PT
1.25
@ IF = 100 mA
@ IF = 200 mA
@ TA = 25oC
Maximum Instantaneous Forward Voltage
VF
IR
1.50
Volts
10
uAmps
Maximum Average Reverse Current
at Ratied DC Blocking Voltage
@ TJ = 100oC
200
uAmps
2003-5
NOTES : 1. Thermal Resistance ( Junction to Lead ) : PC Board Mounted on 0.06 X 0.06" ( 0.15X 0.15mm ) copper pad area.
2. Measured at 1.0 MHZ and applied reverse voltage of 0 volt.
3. IF=IR=20 mA, IRR=0.1XIR, RL=50 ohms