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LHDF-RB10300005000

更新时间： 2022-02-26 10:12:56

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LHDF-RB10300005000 数据手册

LUXEON Flip Chip

Chip Scale Package LED

Introduction

Philips Lumileds LUXEON^®Flip Chip LEDTechnology enables the next generation of lighting applications.

Customers now have complete design ﬂexibility to access Lumileds’ industry leading performance at the die level

and customize the phosphor and packaging to best suit their lighting applications.

LUXEON Flip Chip is a real Chip Scale Package LED that can be attached by reﬂow without additional packaging.

Traditional wire bonding limits the packing and power density of LEDs. LUXEON Flip Chip LEDs can be packaged

closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen

output at higher lumen densities.

This document contains the performance data needed to design and engineer Philips Lumileds LUXEON Flip Chip

based application.

Features

Beneﬁts

•ꢀHigh current density for high

Key Applications

•ꢀHigh-power LED emitters

•ꢀChip on board applications

•ꢀRemote phosphor applications

•ꢀHigh drive current up to 1A/mm²

•ꢀ 1.0 mm x 1.0 mm 5-sided emitter

•ꢀ440-460 nm wave length

•ꢀLow typical forward voltage of 2.9V

•ꢀLow thermal resistance

lumen and lm/$ at high lm/W

•ꢀHigh-packaging density

•ꢀ5-sided emitter for dispense and

remote phosphor applications

•ꢀSurface mount capable

•ꢀNo wire bonds

•ꢀSymmetric, large bond pads bumped

with AuSn solder

•ꢀRobust design with proven

Lumileds reliability

12 3 4 5 6 7...12

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