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LESD8L3.3CT3G PDF预览

LESD8L3.3CT3G

更新时间: 2024-10-29 01:23:39
品牌 Logo 应用领域
乐山 - LRC 局域网二极管
页数 文件大小 规格书
4页 143K
描述
ESD Protection Diodes with Ultra-Low Capacitance

LESD8L3.3CT3G 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:R-PBCC-N2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.77其他特性:EXCELLENT CLAMPING CAPABILITY, ULTRA LOW CAPACITANCE
最小击穿电压:4.8 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码:R-PBCC-N2元件数量:1
端子数量:2最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性:BIDIRECTIONAL
最大功率耗散:0.15 W参考标准:IEC-61000-4-2
最大重复峰值反向电压:3.3 V表面贴装:YES
技术:AVALANCHE端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

LESD8L3.3CT3G 数据手册

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LESHAN RADIO COMPANY, LTD.  
LESD8L3.3CT5G  
Transient Voltage  
Suppressors  
LESD8L3.3CT5G  
ESD Protection Diodes with UltraLow  
Capacitance  
1
The ESD8L is designed to protect voltage sensitive components that  
require ultralow capacitance from ESD and transient voltage events.  
Excellent clamping capability, low capacitance, low leakage, and fast  
response time, make these parts ideal for ESD protection on designs  
where board space is at a premium. Because of its low capacitance, it is  
suited for use in high frequency designs such as USB 2.0 high speed and  
antenna line applications.  
2
SOD882  
Specification Features:  
Ultra Low Capacitance 0.5 pF  
Low Clamping Voltage  
1
2
Small Body Outline Dimensions:  
0.039x 0.024(1.00 mm x 0.60 mm)  
Low Body Height: 0.016(0.4 mm)  
Standoff Voltage: 3.3 V  
Low Leakage  
Response Time is Typically < 1.0 ns  
IEC6100042 Level 4 ESD Protection  
This is a PbFree Device  
Ordering information  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V0  
Device  
Marking  
Shipping  
LESD8L3.3CT1G  
LESD8L3.3CT3G  
LESD8L3.3CT5G  
S
S
S
5000/Tape&Reel  
8000/Tape&Reel  
LEAD FINISH: 100% Matte Sn (Tin)  
10000/Tape&Reel  
QUALIFIED MAX REFLOW TEMPERATURE:  
260°C  
Device Meets MSL 1 Requirements  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
IEC 6100042 (ESD)  
Contact  
Air  
10  
15  
kV  
Total Power Dissipation on FR5 Board  
°P °  
D
150  
mW  
(Note 1) @ T = 25°C  
A
Storage Temperature Range  
Junction Temperature Range  
T
55 to +150  
55 to +125  
260  
°C  
°C  
°C  
stg  
T
J
Lead Solder Temperature Maximum  
T
L
(10 Second Duration)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR5 = 1.0 x 0.75 x 0.62 in.  
Rev.O 1/4  

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