Datasheet > LE80537GF0484M

LE80537GF0484M

更新时间： 2024-02-03 00:42:35

品牌	Logo	应用领域
英特尔 - INTEL		外围集成电路
页数	文件大小	规格书
104页	3353K
描述
Microprocessor, 64-Bit, 2160MHz, CMOS, PBGA479, MICRO, FCBGA-479

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LE80537GF0484M 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	BGA,
针数：	479	Reach Compliance Code：	compliant
风险等级：	5.8	地址总线宽度：	36
位大小：	64	边界扫描：	NO
外部数据总线宽度：	64	格式：	FIXED POINT
集成缓存：	YES	JESD-30 代码：	S-PBGA-B479
长度：	35 mm	低功率模式：	YES
端子数量：	479	封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装形状：	SQUARE
封装形式：	GRID ARRAY, HEAT SINK/SLUG	认证状态：	Not Qualified
座面最大高度：	2.963 mm	速度：	2160 MHz
最大供电电压：	1.3 V	最小供电电压：	0.75 V
表面贴装：	YES	技术：	CMOS
端子形式：	BALL	端子节距：	1.27 mm
端子位置：	BOTTOM	宽度：	35 mm
uPs/uCs/外围集成电路类型：	MICROPROCESSOR	Base Number Matches：	1

LE80537GF0484M 数据手册

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improve performance of video, audio, and image processing

for multimedia, encryption, financial, engineering, and scientific

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rate of one per clock cycle, effectively doubles speed of execu-

tion over previous-generation processors. 45nm versions include

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set. This provides additional performance improvements in

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encoding in high-definition resolution.

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latency to frequently used data through dynamic allocation

of shared L2 cache.

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execution, reduces time in-flight instructions must wait

for data, and moves data from system memory into fast

L2 cache prior to execution.

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Intel® Core™2 Duo Processors

Embedded Computing

Intel^®Core^™2 Duo Processors

for Embedded Computing

Processors T9400, P8400, SL9400, SL9380, SP9300, SU9300,

T7500, T7400, L7500, L7400 and U7500

Product Overview

Intel® Core™2 Duo processors – members of Intel’s growing prod-

uct line of multi-core processors based on Intel® Core™ microarchi-

tecture – now feature 45nm process technology to deliver even

greater energy-efficient performance. Intel Core 2 Duo processor

technology makes it possible to integrate two complete execu-

tion cores in one physical package, providing advancements in

simultaneous computing for multi-threaded applications and multi-

tasking environments. Intel’s hafnium-based 45nm Hi-k silicon

process technology enables even more processor performance

by doubling transistor density and increasing cache size by up to

50 percent. The result is improved speed and efficiency, relative

to previous-generation dual-core Intel® processors.

Intel Core 2 Duo processors meet the needs of a wide range

of performance-intensive, low-power embedded applications

in smaller form factors such as retail and transaction services

(i.e., point-of-service terminals and ATMs), gaming platforms,

industrial control and automation, digital security surveillance

and medical imaging. While incorporating advanced processor

technology, they remain software-compatible with previous

IA-32 processors.

Arch State

Execution

Resources

Execution

Resources

L1 Caches

APIC

L1 Caches

APIC

Intel® Core™ Microarchitecture

Shared L2 Cache

Energy-efficient performance helps equipment manufacturers

optimally balance processing capabilities within power and

space constraints.

Power Mgmt.

Coordination Logic Coordination Logic

Core

Bus Interface

complete up to four full instructions per clock cycle.

Intel® Core™2 Duo processors, based on Intel® Core™ microarchi-

tecture, include two complete execution cores, shared L2 cache,

and intelligent power management capabilities. These features

deliver significantly greater performance-per-watt over previous-

generation dual-core Intel® processors.

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