Datasheet > LDTA124XET1G

LDTA124XET1G

更新时间： 2024-10-29 00:51:47

品牌	Logo	应用领域
乐山 - LRC		/
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Bias Resistor Transistors

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LDTA124XET1G 数据手册

LESHAN RADIO COMPANY, LTD.

Bias Resistor Transistors

PNP Silicon Surface Mount Transistors

LDTA114EET1G Series

with Monolithic Bias Resistor Network

This new series of digital transistors is designed to replace a single

device and its external resistor bias network. The BRT (Bias Resistor

Transistor) contains a single transistor with a monolithic bias network

consisting of two resistors; a series base resistor and a base-emitter

resistor. The BRT eliminates these individual components by integrating

them into a single device. The use of a BRT can reduce both system

cost and board space. The device is housed in the SC-89 package

which is designed for low power surface mount applications.

SC-89

PIN 3

COLLECTOR

(OUTPUT)

• Simplifies Circuit Design

PIN 1

BASE

(INPUT)

• Reduces Board Space

• Reduces Component Count

PIN 2

EMITTER

(GROUND)

• The SC-89 package can be soldered using wave or reflow. The

modified gull-winged leads absorb thermal stress during soldering

eliminating the possibility of damage to the die.

compliance with

We declare that the material of product

RoHS requirements.

•

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

Rating

Collector-Base Voltage

Symbol

Value

Unit

Vdc

CBO

CEO

Collector-Emitter Voltage

Collector Current

Vdc

100

mAdc

THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Total Device Dissipation, FR−4 Board

(Note 1) @ T = 25°C

Derate above 25°C

200

1.6

mW/°C

Thermal Resistance, Junction−to−Ambient

(Note 1)

600

°C/W

Total Device Dissipation, FR−4 Board

(Note 2) @ T = 25°C

Derate above 25°C

300

2.4

mW/°C

Thermal Resistance, Junction−to−Ambient

(Note 2)

400

°C/W

Junction and Storage Temperature Range

T , T

−55 to

+150

°C

stg

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−4 @ Minimum Pad.

2. FR−4 @ 1.0 × 1.0 Inch Pad.

Rev.O 1/12

12 3 4 5 6 7...12

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