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LCAS6-10-L PDF预览

LCAS6-10-L

更新时间: 2024-09-23 22:41:03
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VICOR /
页数 文件大小 规格书
4页 690K
描述
VI CHIP Evaluation Board

LCAS6-10-L 数据手册

 浏览型号LCAS6-10-L的Datasheet PDF文件第2页浏览型号LCAS6-10-L的Datasheet PDF文件第3页浏览型号LCAS6-10-L的Datasheet PDF文件第4页 
TM  
V I CHIP  
Evaluation Board  
Oscilloscope probe jack  
for output voltage and  
ripple measurements  
Parallelable  
This board suitable for the  
following V•I Chip products:  
Bus Converter Module (BCM)  
Voltage Transformation  
Module (VTM)  
Simple to use  
Ring lug or solder connections  
The V•I Chip evaluation board offers a convenient means to  
evaluate the performance of Vicor’s Bus Converter Modules  
(BCM) or Voltage Transformation Modules (VTM).  
The board has been optimized for user convenience.  
2. + OUT, -OUT  
An electronic or passive load should be connected to this  
location with short heavy gauge leads. Most commercially  
available electronic loads do not have current slew rates  
capable of exercising the V•I Chips capability. The evaluation  
board can be connected directly to the application for which  
the V•I Chip is intended; however, the interconnect  
impedances between the evaluation board and the application  
can greatly effect the transient response. For applications  
where transient response is critical, the user should consider  
mounting the V•I Chip directly to the target application PCB.  
Refer to the appropriate V•I Chip datasheet for performance  
and operating limits. The datasheets are available for  
downloading at vicorpower.com.  
It is important to remember that given the fast response of most  
V•I Chips, they can readily show the limitations of the source,  
load, and associated wiring connected to the evaluation board.  
Care should be exercised to minimize stray source and load  
impedances in order to fully exercise the V•I Chip.  
3. OUTPUT VOLTAGE MEASUREMENT JACK (J1)  
This connector is provided to make an accurate  
measurements of the output voltage of the V•I Chip. Many  
types of scope probes may be directly connected to this  
point if the probe is equipped with a removable plastic  
sheath. Be careful to avoid creating ground loops when  
making measurements of the output or input voltage. It is  
recommended that the measurements be made separately.  
Please refer to Figure 1 for locations of the input and output  
connections as viewed from the component side. Wires may be  
soldered directly to the pads in lieu of ring lugs if desired to  
minimize circuit impedances.  
The evaluation board should be set up as follows:  
Note: Care should be taken to avoid reversing polarities  
if connecting to the opposite (solder) side of the board.  
4. PARALLELING  
The paralleling and current sharing capability of the devices  
can be demonstrated by stacking multiple evaluation PCBs  
and interconnecting the inputs and outputs with standoffs  
of sufficient current handling capability to create a  
3-dimensional array. See Figure 3.  
1. + IN, - IN  
Connect a high quality, low noise power supply to this  
location. The interconnect leads should be heavy gauge  
and as short as possible. Additional capacitance may  
have to be added on the evaluation board to make up  
for impedances in the interconnect leads as well as  
deficiencies in the source. It is important to remember  
that noise from the source, as well as any input source  
voltage drops, will appear at the output of the V•I Chip  
multiplied by its k factor.  
5. INPUT CURRENT MEASUREMENT  
A current probe can be passed around the +IN lead connected  
to the V•I Chip. Input capacitors on the evaluation board  
are downstream of this measurement point.  
Vicor Corporation Tel: 800-735-6200 vicorpower.com V•I Chip Evaluation Board  
Rev. 1.2  
Page 1 - 4  
45  

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