Datasheet > L9D364M64SBG2

L9D364M64SBG2

更新时间： 2024-09-25 12:48:15

品牌	Logo	应用领域
逻辑 - LOGIC		双倍数据速率
页数	文件大小	规格书
159页	3514K
描述
4.0 Gb, DDR3, 64 M x 64 Integrated Module

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中文翻译

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数据手册

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L9D364M64SBG2 数据手册

L9D364M64SBG2

4.0 Gb, DDR3, 64 M x 64 Integrated Module (IMOD)

Benefits

FEATURES

DDR3 Integrated Module [iMOD]:

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iMOD Part Information

ORDER NUMBER

SPEED GRADE

PKG FOOTPRINT

I/O

PITCH

PKG NO.

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DDR3-1866

DDR3-1600

DDR3-1333

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BG2

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DDR3-1066

DDR3-800

integrated module products

LOGIC Devices Incorporated

www.logicdevices.com

High Performance, Integrated Memory Module Product

May 3, 2012 LDS-L9D364M64SBG2-G

12 3 4 5 6 7...159

中文翻译

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与L9D364M64SBG2相关器件

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L9H RID1.9x2x3.4H0.9(Balun)	TDK	获取价格	Balun Cores(RID/Double-Aperture)
L9H RID1.9x2x3.4H0.9(EMC)	TDK	获取价格	EMC Suppression(RID/Double-Aperture)
L9H RID2.6x4x5.1H1.4(Balun)	TDK	获取价格	Balun Cores(RID/Double-Aperture)
L9H RID2.6x4x5.1H1.4(EMC)	TDK	获取价格	EMC Suppression(RID/Double-Aperture)
L9H RID3x2x5H1.2(Balun)	TDK	获取价格	Balun Cores(RID/Double-Aperture)
L9H RID3x2x5H1.2(EMC)	TDK	获取价格	EMC Suppression(RID/Double-Aperture)
L9H RID3x3x5H1.2(Balun)	TDK	获取价格	Balun Cores(RID/Double-Aperture)
L9H RID3x3x5H1.2(EMC)	TDK	获取价格	EMC Suppression(RID/Double-Aperture)
L9H RID3x5x5H1.2(Balun)	TDK	获取价格	Balun Cores(RID/Double-Aperture)
L9H RID3x5x5H1.2(EMC)	TDK	获取价格	EMC Suppression(RID/Double-Aperture)

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