PRELIMINARY INFORMATION L9D340G64BG2
4.0 Gb, DDR3, 64 M x 64 Integrated Module (IMOD)
Benefits
FEATURES
DDR3 Integrated Module [iMOD]:
• Vcc=VccQ=1.5V ± 0.075V
Self/Auto Refresh modes
40% space savings while provid-
ing a surface mount friendly pitch
(1.00mm)
Operating Temperature Range (Case
Temp=Tc)
• 1.5V center-terminated, push/pull
I/O
Reduced I/O routing (34%)
• Industrial: -40˚C to 85˚C supporting
SELF & AUTO REFRESH
30% improvement in routings for your
memory array
• Package: 16mm x 22mm, 13 x 21
matrix w/ 271balls
• Extended: -40˚C to 105˚C; manual
REFRESH only
Reduced trace lengths due to
the highly integrated, impedance
matched packaging
• Matrix ball pitch: 1.00mm
Space saving footprint
• Mil-Temp: -55˚C to 125˚C; manual
REFRESH only
Thermally enhanced, Impedance
matched, integrated packaging
Thermally enhanced packaging
technology allow silicon integration
without performance degradation due
to power dissipation (heat)
CORE clocking frequencies:
• Industrial: 667MHz, 533MHz and
400MHz
Differential, bidirectional data strobe
8n-bit prefetch architecture
• Extended: 533MHz and 400MHz
• Mil-Temp: 400MHz
8 internal banks (per word, 4 words
integrated in package)
High TCE organic laminate inter-
poser for improved glass stability
over a wide operating temperature
Data Transfer Rates:
Nominal and dynamic on-die termina-
tion (ODT) for data, strobe, and mask
signals.
• Industrial: 1333, 1066 and 800
Mbps
Suitability of use in High Reliability
applications requiring Mil-temp, non-
hermetic device operation
• Extended: 1066 and 800 Mbps
• Mil-Temp: 800 Mbps
CAS (READ) latency (CL): 6, 8, and
10
Write leveling
CAS (WRITE) latency (CWL): 6, 7
and 8
*Note: This integrated product and/or its specifications
are subject to change without notice. Latest document
should be retrieved from LDI prior to your design
consideration.
Multipurpose register
Output Driver Calibration
Fixed burst length (BL) of 8 and burst
chop (BC) of 4
Selectable BC4 or BL8 on-the-fly
(OTF)
iMOD Part Information
ORDER NUMBER
SPEED GRADE
DEVICE GRADE
PKG FOOTPRINT
I/O
PITCH
PKG NO.
L9D340G64BG2I15
L9D340G64BG2E19
L9D340G64BG2M25
DDR3-1333
DDR3-1066
DDR3-800
Industrial
Extended
Mil-Temp
16mm x 22mm
271
1.00mm
BG2
integrated module products
LOGIC Devices Incorporated
www.logicdevices.com
High Performance, Integrated Memory Module Product
1
May 19, 2009 LDS-L9D340G6BG2-A