Datasheet > L9D320G32BG6

L9D320G32BG6

更新时间： 2024-01-31 15:31:52

品牌	Logo	应用领域
逻辑 - LOGIC		双倍数据速率
页数	文件大小	规格书
154页	3285K
描述
2.0 Gb, DDR3, 64 M x 32 Integrated Module (IMOD)

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中文翻译

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数据手册

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L9D320G32BG6 数据手册

ADVANCE INFORMATION L9D320G32BG6

2.0 Gb, DDR3, 64 M x 32 Integrated Module (IMOD)

Beneﬁts

FEATURES

DDR3 Integrated Module [iMOD]:

• Vcc=VccQ=1.5V ± 0.075V

Self/Auto Refresh modes

32% space savings while provid-

ing a surface mount friendly pitch

(1.00mm)

Operating Temperature Range (Case

Temp=Tc)

• 1.5V center-terminated, push/pull

I/O

Reduced I/O routing (33%)

• Industrial: -40˚C to 85˚C supporting

SELF & AUTO REFRESH

25% improvement in routings for your

memory array

• Package: 16mm x 12mm, 10 x 13

matrix w/ 129 balls

• Extended: -40˚C to 105˚C; manual

REFRESH only

Reduced trace lengths due to

the highly integrated, impedance

matched packaging

• Matrix ball pitch: 1.00mm

Space saving footprint

• Mil-Temp: -55˚C to 125˚C; manual

REFRESH only

Thermally enhanced, Impedance

matched, integrated packaging

Thermally enhanced packaging

technology allow silicon integration

without performance degradation due

to power dissipation (heat)

CORE clocking frequencies:

• Industrial: 667MHz, 533MHz and

400MHz

Differential, bidirectional data strobe

8n-bit prefetch architecture

• Extended: 533MHz and 400MHz

• Mil-Temp: 400MHz

8 internal banks (per word, 2 words

integrated in package)

High TCE organic laminate inter-

poser for improved glass stability

over a wide operating temperature

Data Transfer Rates:

Nominal and dynamic on-die termina-

tion (ODT) for data, strobe, and mask

signals.

• Industrial: 1333, 1066 and 800

Mbps

Suitability of use in High Reliability

applications requiring Mil-temp, non-

hermetic device operation

• Extended: 1066 and 800 Mbps

• Mil-Temp: 800 Mbps

CAS (READ) latency (CL): 6, 8, and

Write leveling

CAS (WRITE) latency (CWL): 6, 7

and 8

*Note: This integrated product is currently under

consideration. Latest product status, information, and/

or corresponding documents should be obtained from

LDI prior to your design consideration.

Multipurpose register

Output Driver Calibration

Fixed burst length (BL) of 8 and burst

chop (BC) of 4

Selectable BC4 or BL8 on-the-ﬂy

(OTF)

iMOD Part Information

ORDER NUMBER

SPEED GRADE

DEVICE GRADE

PKG FOOTPRINT

I/O

PITCH

PKG NO.

L9D320G32BG6I25

L9D320G32BG6E25

L9D320G32BG6M25

DDR3-1333

DDR3-1066

DDR3-800

Industrial

Extended

Mil-Temp

16mm x 12mm

129

1.00mm

BG2

integrated module products

LOGIC Devices Incorporated

www.logicdevices.com

High Performance, Integrated Memory Module Product

Jul 08, 2009 LDS-L9D320G32BG6-A

12 3 4 5 6 7...154

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与L9D320G32BG6相关器件

型号	品牌	获取价格	描述	数据表
L9D320G32BG6E25	LOGIC	获取价格	2.0 Gb, DDR3, 64 M x 32 Integrated Module (IMOD)
L9D320G32BG6I25	LOGIC	获取价格	2.0 Gb, DDR3, 64 M x 32 Integrated Module (IMOD)
L9D320G32BG6M25	LOGIC	获取价格	2.0 Gb, DDR3, 64 M x 32 Integrated Module (IMOD)
L9D3256M32DBG2	LOGIC	获取价格	16-32 Gb, DDR3, 256-512M x 32 Dual Channel Memory Module
L9D3256M32SBG1	LOGIC	获取价格	8-16 Gb, DDR3, 256-512M x 32 Single Channel Memory Module
L9D3256M32SBG1C125	LOGIC	获取价格	DRAM,
L9D3256M72SBG2	LOGIC	获取价格	18-20 Gb, DDR3, 256 M x 72/80 Integrated Module
L9D3256M80SBG2	LOGIC	获取价格	18-20 Gb, DDR3, 256 M x 72/80 Integrated Module
L9D340G64BG2	LOGIC	获取价格	4.0 Gb, DDR3, 64 M x 64 Integrated Module (IMOD)
L9D340G64BG2E19	LOGIC	获取价格	4.0 Gb, DDR3, 64 M x 64 Integrated Module (IMOD)

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