Datasheet > L1F3-U400100005001

L1F3-U400100005001

更新时间： 2024-11-30 22:56:11

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L1F3-U400100005001 数据手册

IllumInatIon

luXeon uV Fc liꢀꢁ

Unique LED enabling limitless

design freedom

With FlipChip platform technology, the LUXEON UV FC Line is the smallest

and highest power density (W/cm²) ultraviolet LED with FlipChip Technology

in a Chip Scale Package (CSP). The LED can be reﬂowed onto a substrate

with standard surface mount (SMT) equipment and process. LUXEON UV

FC Line LEDs enable tighter beam control and high packing density of

LEDs on a chip on board solution and completely eliminate wire bonds

in the system. LUXEON UV FC Line is the ideal choice for cost sensitive

applications to achieve high irradiance at high current density, maximizing

W/$ by taking advantage of lowest thermal resistance of a CSP device.

Features and BeneFIts

PrImary aPPlIcatIons

Ultraviolet wavelength range of 380nm to 420nm for a range of options

Micro sized CSP: 1.0mm²package for design ﬂexibility and packing density

No wire bonds allows for direct attach and reﬂow

5-sided emitter with batwing radiation pattern

Specialty Lighting

– Analytical Instrumentation

– Curing

– Medical

Low thermal resistance for leading system level W/$

– Security

Maximum drive current of 1A/mm²delivers superior ﬂux for reduced

LED count

RoHS

COMPLIANT

12 3 4 5 6 7...16

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型号	品牌	获取价格	描述	数据表
L1F3-U400100007001	LUMILEDS	获取价格	LED UV U2 400NM 700MW SMD
L1F3-U400200010000	LUMILEDS	获取价格	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) te
L1F3-U400200012000	LUMILEDS	获取价格	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) te
L1F3-U400200014000	LUMILEDS	获取价格	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) te
L1F3-U410100005001	LUMILEDS	获取价格	LED UV U2 410NM 500MW SMD
L1F3-U410200012000	LUMILEDS	获取价格	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) te
L1F3-U410200014000	LUMILEDS	获取价格	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) te
L1GJ40C604KA05	KEMET	获取价格	KPS-MCC Indust C0G HT200C, Ceramic, 0.6 uF, 10%, 500 VDC, C0G
L1GJ40D224JA04	KEMET	获取价格	KPS-MCC Indust C0G HT200C, Ceramic, 0.22 uF, 5%, 1000 VDC, C0G
L1GJ501304JA01	KEMET	获取价格	KPS-MCC Indust C0G HT200C, Ceramic, 0.3 uF, 5%, 100 VDC, C0G