KPM8N60D
SEMICONDUCTOR
N CHANNEL MOS FIELD
EFFECT TRANSISTOR
TECHNICAL DATA
General Description
U
X
V
This Super Junction MOSFET has better characteristics, such as fast
switching time, low on resistance, low gate charge, low EMI
characteristics and excellent avalanche characteristics. It is mainly
suitable for active power factor correction and switching mode power
supplies.
DIM MILLIMETERS
W
_
6.60 + 0.20
A
B
C
D
E
_
6.10+0.20
_
5.34 + 0.30
_
0.70+0.20
_
2.70 + 0.15
_
2.30+0.10
F
0.96 MAX
0.90 MAX
G
H
R
_
J
K
L
1.80+0.20
A
C
L
_
M
0.76+0.20
D
B
FEATURES
_
2.30+0.10
_
0.50 + 0.10
M
N
O
Q
R
S
•
VDSS=600V, ID=8A
_
0.50+0.10
•
0.70 MIN
2.4 0.2
Drain-Source ON Resistance :
RDS(ON)(Max)=0.58Ω
5.0 0.2
1.75 0.3
5.0 0.3
•
@VGS=10V Qg(typ.)= 16nC
H
T
J
K
F
E
5.34 0.3
0.27 0.05
0.77 0.1
2.0 0.1
U
V
W
X
O
G
N
F
MAXIMUM RATING (Tc=25
)
℃
Q
1
2
3
1. GATE
2. DRAIN
3. SOURCE
CHARACTERISTIC
SYMBOL
RATING
UNIT
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
600
± 30
8*
V
V
DPAK (1)
@T =25
℃
C
ID
Drain Current
@TC=100℃
5*
A
IDP
Pulsed (Note1)
16*
I
Single Pulsed Avalanche Energy
(Note 2)
EAS
139
3.9
4.5
mJ
mJ
DIM
MILLIMETERS
K
_
Repetitive Avalanche Energy
(Note 1)
A
B
C
D
E
F
6.60+0.1
EAR
_
6.1+0.1
_
+
5.33 0.2
A
C
Peak Diode Recovery dv/dt
(Note 3)
H
J
_
dv/dt
V/ns
W
+
1.1 0.2
D
B
2.90 REF
_
+
2.286 0.1
56.8
0.45
150
Tc=25
℃
Drain Power
Dissipation
PD
G
H
I
0.9 Max.
_
+
2.3 0.1
Derate above 25
W/
℃
℃
5.25 Min
Tj
Maximum Junction Temperature
Storage Temperature Range
Thermal Characteristics
_
℃
J
0.5+0.1
M
K
L
M
N
4.70 Min
0.508 BSC
0.75 Max
E
N
G
Tstg
-55 150
℃
∼
L
F
_
+
1.5 0.2
1
2
3
RthJC
RthJA
Thermal Resistance, Junction-to-Case
2.2
℃
℃
/W
/W
1. GATE
2. DRAIN
3. SOURCE
Thermal Resistance,
Junction-to-Ambient
110
* : Drain current limited by maximum junction temperature.
DPAK (3)
PIN CONNECTION
D
G
S
2022. 03. 30
Revision No : 4
1/6