Mobile Intel® Pentium III
Processor in BGA2 and Micro-
PGA2 Packages
Featuring Intel SpeedStep™ Technology at
850 MHz, 800 MHz, 750 MHz, 700 MHz, Low-
voltage 600 MHz, and Ultra Low-voltage 500
MHz
Datasheet
Product Features
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Processor core/bus speeds:
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Supports the Intel Architecture with Dynamic
Execution
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Featuring Intel® SpeedStepTM technology:
850/100 MHz ( Maximum Performance Mode
at 1.60V) and 700/100 MHz (Battery
Optimized Mode at 1.35V)
Featuring Intel® SpeedStepTM technology:
800/100 MHz ( Maximum Performance Mode
at 1.60V) and 650/100 MHz (Battery
Optimized Mode at 1.35V)
Featuring Intel® SpeedStepTM technology:
750/100 MHz ( Maximum Performance Mode
at 1.60V) and 600/100 MHz (Battery
Optimized Mode at 1.35V)
Featuring Intel® SpeedStepTM technology:
700/100 MHz ( Maximum Performance Mode
at 1.60V) and 550/100 MHz (Battery
Optimized Mode at 1.35V)
Featuring Intel® SpeedStepTM technology:
600/100 MHz ( Maximum Performance Mode
at 1.35V) and 500/100 MHz (Battery
Optimized Mode at 1.10V)
On-die primary 16-Kbyte instruction cache
and 16-Kbyte write-back data cache
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On-die second level cache (256-Kbyte)
Integrated GTL+ termination
Integrated math co-processor
Intel Processor Serial Number
BGA2 and Micro-PGA2 packaging
technologies
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Supports thin form factor notebook
designs
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Exposed die enables more efficient
heat dissipation
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Fully compatible with previous Intel
microprocessors
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Binary compatible with all applications
Support for MMX™ technology
Support for Streaming SIMD
Extensions
Featuring Intel® SpeedStepTM technology:
500/100 MHz ( Maximum Performance Mode
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Power Management Features
at 1.1V) and 300/100 MHz (Battery
Optimized Mode at 0.975V)
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Quick Start and Deep Sleep modes
provide low power dissipation
On-die thermal diode
Datasheet
249409-001