COUNT
COUNT DESCRIPTION OF REVISIONS
DESCRIPTION OF REVISIONS
CHKD
CHKD
DATE
DATE
BY
BY
△
△
△
△
APPLICABLE STANDARD
OPERATING
STORAGE
TEMPERATURE
STORAGE
-55℃ ~ +125℃(NOTE1)
-10℃ ~ +60℃(NOTE2)
TEMPERATURE
RATING VOLTAGE
CURRENT
AC 50V
RELATIVE HUMIDITY 85% MAX
(NOT DEWED)
HUMIDITY RANGE
OPERATING
HUMIDITY RANGE
SIGNAL CONTACT : 0.5A(NOTE3)
SPECIFICATIONS
TEST METHOD
ITEM
REQUIREMENTS
QT AT
CONSTRUCTION
ACCORDING TO DRAWING.
GENERAL EXAMINATION
MARKING
VISUALLY AND BY MEASURING INSTRUMENT.
CONFIRMED VISUALLY.
X
X
X
X
ELECTRICAL CHARACTERISTICS
CONTACT RESISTANCE
100mA(DC or 1000Hz)
SIGNAL CONTACT : 50mΩ MAX.
X
-
INSULATION RESISTANCE
VOLTAGE PROOF
100V DC.
100MΩ MIN.
X
X
-
150V AC FOR 1 min.
NO FLASHOVER OR BREAKDOWN.
X
MECHANICAL CHARACTERISTICS
INSERTION AND
INSERTION FORCE : 45N MAX.
WITHDRAWAL FORCE : 3N MIN.
① CONTACT RESISTANCE:
SIGNAL CONTACT : 70mΩ MAX.
② NO DAMAGE, CRACK AND LOOSENESS OF
PARTS.
MEASURED BY APPLICABLE CONNECTOR.
X
X
-
-
WITHDRAWAL FORCES
MECHANICAL OPERATION
100 TIMES INSERTIONS AND EXTRACTIONS.
VIBRATION
SHOCK
FREQUENCY 10 TO 55 TO 10 Hz, APPROX 5min ① NO ELECTRICAL DISCONTINUITY OF 1㎲.
SINGLE AMPLITUDE : 0.75mm,
② NO DAMAGE, CRACK AND LOOSENESS OF
X
X
-
-
10CYCLES FOR 3AXIAL DIRECTIONS.
PARTS.
490m/s2 , DURATION OF PULSE 11ms
AT 3TIMES FOR 3 BOTH AXIAL DIRECTIONS.
ENVIRONMENTAL CHARACTERISTICS
DAMP HEAT
EXPOSED AT 40±2℃, 90 ~ 95%, 96h.
① CONTACT RESISTANCE:
X
X
-
-
(STEADY STATE)
SIGNAL CONTACT : 70mΩ MAX.
② INSULATION RESISTANCE: 100MΩ MIN.
③ NO DAMAGE, CRACK AND LOOSENESS OF
PARTS.
TEMPERATURE -55 → +125℃
RAPID CHANGE OF
TEMPERATURE
TIME
30 → 30 min.
UNDER 5 CYCLES.
(RELOCATION TIME TO CHAMBER: WITHIN 2~3MIN)
COLD
EXPOSED AT -55℃, 96h
EXPOSED AT 125℃, 96h
① CONTACT RESISTANCE:
SIGNAL CONTACT : 70mΩ MAX.
② NO DAMAGE, CRACK AND LOOSENESS OF
PARTS.
X
X
-
-
DRY HEAT
SULFUR DIOXIDE
EXPOSED AT 25±2℃, 75±5%RH, 25 PPM FOR
96h.
(TEST STANDARD: IEC 68)
① NO DEFECT SUCH AS CORROSION WHICH
IMPAIRS THE FUNCTION OF CONNECTOR.
② CONTACT RESISTANCE:
X
-
SIGNAL CONTACT : 70mΩ MAX.
RESISTANCE TO
SOLDERING HEAT
1) REFLOW SOLDERING:
PEAK TMP : 260℃ MAX
NO DEFORMATION OF CASE OF EXCESSIVE
LOOSENESS OF THE TERMINAL.
X
X
-
-
REFLOW TMP : 220℃ MIN FOR 60sec.
2) SOLDERING IRONS : 360℃ MAX FOR 5sec.
SOLDERED AT SOLDER TEMPERATURE
240±3℃ FOR IMMERSION DURATION, 3sec.
A NEW UNIFORM COATING OF SOLDER
SHALL
COVER A MINIMUM OF 95% OF THE SURFACE
SOLDERABILITY
REFERENCE DRWING
DRAWN
DESIGNED
CHECKED
APPROVED
RELEASED
REMARKS CONDITIONS FOR TESTING
(NOTE 1) : INCLUDE TEMPERATURE RISE CAUSED BY CURRENT
-CARRYING.
(NOTE 2) : "STORAGE" MEANS A LONG-TERM STORAGE STATE
FOR THE UNUSED PRODUCT BEFORE ASSEMBLY TO PCB.
(NOTE 3) : WHEN THE SAME VALUE OF CURRENT ARE APPLIED
TO ALL CONTACTS AT THE SAME TIME IN ONCE, SET THE
CURRENT TO THE 70% OF THE RATED CURRENT VALUE.
UNLESS OTHERWISE SPECIFIED, REFER TO IEC 60512
ENG
20.03.20
DEPT
J.H.PARK
19.08.22
J.H.PARK W.S.YOON
19.08.22 19.08.23
B.H.AN
19.08.23
NOTE QT: QUALIFICATION TEST AT: ASSURANCE TEST X: APPLICABLE TEST
PART NO.
HIROSE KOREA CO.,LTD.
SPECIFICATION SHEET
KP27F-60S-0.5SV(800)
CL 6547-0006-1-800
CODE NO.(OLD)
DRAWING NO.
CODE NO.
1
ELC4-632364
CL
1