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KMC7457VG1000NC PDF预览

KMC7457VG1000NC

更新时间: 2024-11-01 20:11:31
品牌 Logo 应用领域
恩智浦 - NXP 时钟外围集成电路
页数 文件大小 规格书
71页 754K
描述
32-BIT, 1000MHz, RISC PROCESSOR, CBGA483, 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-483

KMC7457VG1000NC 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA,
针数:483Reach Compliance Code:not_compliant
ECCN代码:3A991HTS代码:8542.31.00.01
风险等级:5.38地址总线宽度:36
位大小:32边界扫描:YES
最大时钟频率:167 MHz外部数据总线宽度:64
格式:FLOATING POINT集成缓存:YES
JESD-30 代码:S-CBGA-B483JESD-609代码:e1
长度:29 mm低功率模式:YES
湿度敏感等级:1端子数量:483
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:BGA
封装形状:SQUARE封装形式:GRID ARRAY
认证状态:Not Qualified座面最大高度:3.2 mm
速度:1000 MHz最大供电电压:1.35 V
最小供电电压:1.25 V标称供电电压:1.3 V
表面贴装:YES技术:CMOS
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
宽度:29 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

KMC7457VG1000NC 数据手册

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MPC7457EC  
Rev. 8, 04/2013  
Freescale Semiconductor  
Data Sheet: Technical Data  
MPC7457  
RISC  
Microprocessor  
Contents  
This hardware specification is primarily concerned  
with the MPC7457; however, unless otherwise  
noted, all information here also applies to the  
MPC7447. The MPC7457 and MPC7447 are  
implementations of thePowerPC™ microprocessor  
family of reduced instruction set computer (RISC)  
microprocessors. This hardware specification  
describes pertinent electrical and physical  
characteristics of the MPC7457. For functional  
characteristics of the processor, refer to the  
MPC7450 RISC Microprocessor Family Users  
Manual.  
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
3. Comparison with the MPC7455, MPC7445,  
MPC7450, MPC7451, and MPC7441 . . . . . . . . . . . . 9  
4. General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
5. Electrical and Thermal Characteristics . . . . . . . . . . . 11  
6. Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
7. Pinout Listings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
8. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 44  
9. System Design Information . . . . . . . . . . . . . . . . . . . 50  
11. Document Revision History . . . . . . . . . . . . . . . . . . . 68  
10. Part Numbering and Marking . . . . . . . . . . . . . . . . . . 65  
To locate any published updates for this hardware  
specification, refer to the website listed on the back  
page of this document.  
Freescale reserves the right to change the detail specifications as may be required  
to permit improvements in the design of its products.  
© 2006 Freescale Semiconductor, Inc. All rights reserved.  

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