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KM44C4100CK-L6 PDF预览

KM44C4100CK-L6

更新时间: 2024-11-26 14:43:03
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
20页 340K
描述
Fast Page DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24

KM44C4100CK-L6 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SOJ包装说明:SOJ, SOJ24/26,.34
针数:24Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.91访问模式:FAST PAGE
最长访问时间:60 ns其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
I/O 类型:COMMONJESD-30 代码:R-PDSO-J24
JESD-609代码:e0长度:17.15 mm
内存密度:16777216 bit内存集成电路类型:FAST PAGE DRAM
内存宽度:4功能数量:1
端口数量:1端子数量:24
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:4MX4
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:SOJ封装等效代码:SOJ24/26,.34
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not Qualified刷新周期:2048
座面最大高度:3.76 mm自我刷新:YES
最大待机电流:0.00025 A子类别:DRAMs
最大压摆率:0.1 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:J BEND端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mmBase Number Matches:1

KM44C4100CK-L6 数据手册

 浏览型号KM44C4100CK-L6的Datasheet PDF文件第2页浏览型号KM44C4100CK-L6的Datasheet PDF文件第3页浏览型号KM44C4100CK-L6的Datasheet PDF文件第4页浏览型号KM44C4100CK-L6的Datasheet PDF文件第5页浏览型号KM44C4100CK-L6的Datasheet PDF文件第6页浏览型号KM44C4100CK-L6的Datasheet PDF文件第7页 
KM44C4000C, KM44C4100C  
KM44V4000C, KM44V4100C  
CMOS DRAM  
4M x 4Bit CMOS Dynamic RAM with Fast Page Mode  
DESCRIPTION  
This is a family of 4,194,304 x 4 bit Fast Page Mode CMOS DRAMs. Fast Page Mode offers high speed random access of memory cells  
within the same row. Power supply voltage (+5.0V or +3.3V), refresh cycle (2K Ref. or 4K Ref.), access time (-5 or -6), power consump-  
tion(Normal or Low power) and package type(SOJ or TSOP-II) are optional features of this family. All of this family have CAS-before-  
RAS refresh, RAS-only refresh and Hidden refresh capabilities. Furthermore, Self-refresh operation is available in L-version.  
This 4Mx4 Fast Page Mode DRAM family is fabricated using Samsung¢s advanced CMOS process to realize high band-width, low power  
consumption and high reliability. It may be used as main memory for high level computer, microcomputer and personal computer.  
FEATURES  
• Fast Page Mode operation  
Part Identification  
• CAS-before-RAS refresh capability  
• RAS-only and Hidden refresh capability  
• Self-refresh capability (L-ver only)  
- KM44C4000C/C-L (5V, 4K Ref.)  
- KM44C4100C/C-L (5V, 2K Ref.)  
- KM44V4000C/C-L (3.3V, 4K Ref.)  
- KM44V4100C/C-L (3.3V, 2K Ref.)  
• Fast parallel test mode capability  
• TTL(5V)/LVTTL(3.3V) compatible inputs and outputs  
• Early Write or output enable controlled write  
• JEDEC Standard pinout  
Active Power Dissipation  
Unit : mW  
5V  
• Available in Plastic SOJ and TSOP(II) packages  
• Single +5V±10% power supply (5V product)  
• Single +3.3V±0.3V power supply (3.3V product)  
3.3V  
Speed  
4K  
2K  
4K  
2K  
-5  
-6  
324  
288  
396  
360  
495  
440  
605  
550  
FUNCTIONAL BLOCK DIAGRAM  
Refresh Cycles  
Part  
VCC  
Refresh  
cycle  
Refresh period  
RAS  
CAS  
W
Vcc  
Vss  
Control  
Clocks  
NO.  
Normal  
L-ver  
VBB Generator  
C4000C  
V4000C  
C4100C  
V4100C  
5V  
3.3V  
5V  
4K  
2K  
64ms  
Data in  
128ms  
Buffer  
Row Decoder  
Refresh Timer  
Refresh Control  
Refresh Counter  
32ms  
3.3V  
DQ0  
to  
DQ3  
Memory Array  
4,194,304 x 4  
Cells  
Performance Range  
A0-A11  
(A0 - A10) *1  
A0 - A9  
(A0 - A10) *1  
Row Address Buffer  
Col. Address Buffer  
Speed  
-5  
Remark  
tRAC  
50ns  
60ns  
tCAC  
tRC  
tPC  
Data out  
Buffer  
13ns  
90ns  
35ns 5V/3.3V  
Column Decoder  
OE  
-6  
15ns 110ns 40ns 5V/3.3V  
Note) *1 : 2K Refresh  
SAMSUNG ELECTRONICS CO., LTD. reserves the right to  
change products and specifications without notice.  

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