是否Rohs认证: | 符合 | 生命周期: | Obsolete |
Reach Compliance Code: | compliant | 风险等级: | 5.72 |
最长访问时间: | 14.5 ns | 命令用户界面: | YES |
数据轮询: | NO | JESD-30 代码: | R-PBGA-B63 |
内存密度: | 536870912 bit | 内存集成电路类型: | FLASH |
内存宽度: | 16 | 湿度敏感等级: | 3 |
部门数/规模: | 512 | 端子数量: | 63 |
字数: | 33554432 words | 字数代码: | 32000000 |
最高工作温度: | 85 °C | 最低工作温度: | -30 °C |
组织: | 32MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA63,10X12,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, FINE PITCH |
页面大小: | 1K words | 并行/串行: | PARALLEL |
电源: | 1.8 V | 认证状态: | Not Qualified |
就绪/忙碌: | YES | 部门规模: | 64K |
最大待机电流: | 0.00005 A | 子类别: | Flash Memories |
最大压摆率: | 0.04 mA | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
切换位: | NO | 类型: | NAND TYPE |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
KFG1216Q2A-DEB6 | SAMSUNG |
获取价格 |
FLASH MEMORY | |
KFG1216Q2A-DEB60 | SAMSUNG |
获取价格 |
Flash, 32MX16, 76ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63 | |
KFG1216Q2A-DED5 | SAMSUNG |
获取价格 |
FLASH MEMORY | |
KFG1216Q2A-DED50 | SAMSUNG |
获取价格 |
Flash, 32MX16, 76ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63 | |
KFG1216Q2A-DED6 | SAMSUNG |
获取价格 |
FLASH MEMORY | |
KFG1216Q2A-DED60 | SAMSUNG |
获取价格 |
Flash, 32MX16, 76ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63 | |
KFG1216Q2A-DIB5 | SAMSUNG |
获取价格 |
FLASH MEMORY | |
KFG1216Q2A-DIB6 | SAMSUNG |
获取价格 |
FLASH MEMORY | |
KFG1216Q2A-DIB60 | SAMSUNG |
获取价格 |
Flash, 32MX16, 76ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63 | |
KFG1216Q2A-DID5 | SAMSUNG |
获取价格 |
FLASH MEMORY |