KF3N50DZ/IZ
SEMICONDUCTOR
N CHANNEL MOS FIELD
EFFECT TRANSISTOR
TECHNICAL DATA
General Description
KF3N50DZ
This planar stripe MOSFET has better characteristics, such as fast
switching time, fast reverse recovery time, low on resistance, low gate
charge and excellent avalanche characteristics. It is mainly suitable for
electronic ballast and switching mode power supplies.
A
C
K
DIM MILLIMETERS
L
D
B
_
6.60 + 0.20
A
B
C
D
E
_
6.10+0.20
_
5.34 + 0.30
_
0.70+0.20
_
2.70 + 0.15
FEATURES
_
2.30+0.10
F
0.96 MAX
0.90 MAX
G
H
J
· VDSS= 500V, ID= 2.5A
H
J
· Drain-Source ON Resistance : RDS(ON)=2.5Ω (Max) @VGS = 10V
· Qg(typ) = 7.50nC
_
1.80+0.20
E
_
2.30+0.10
K
L
G
N
_
0.50 + 0.10
_
0.50+0.10
F
F
M
M
N
0.70 MIN
1
2
3
1. GATE
2. DRAIN
3. SOURCE
MAXIMUM RATING (Tc=25℃)
CHARACTERISTIC
Drain-Source Voltage
Gate-Source Voltage
@TC=25℃
SYMBOL
VDSS
RATING
500
UNIT
V
VGSS
V
±30
2.5
DPAK (1)
ID
Drain Current
@TC=100℃
1.5
A
IDP
Pulsed (Note1)
7
KF3N50IZ
A
C
Single Pulsed Avalanche Energy
(Note 2)
H
EAS
110
4
mJ
mJ
J
Repetitive Avalanche Energy
(Note 1)
EAR
DIM MILLIMETERS
Peak Diode Recovery dv/dt
(Note 3)
dv/dt
10
V/ns
_
6.6 0.2
+
A
B
C
D
E
F
_
6.1 0.2
+
M
40
0.32
W
W/℃
℃
Tc=25℃
_
+
5.34 0.3
Drain Power
P
PD
_
0.7 0.2
+
N
Dissipation
Derate above 25℃
_
9.3 0.3
+
_
2.3 0.2
+
Tj
Maximum Junction Temperature
Storage Temperature Range
150
_
0.76 0.1
G
H
J
+
G
_
2.3 0.1
+
Tstg
-55∼ 150
℃
_
L
0.5 0.1
+
F
F
_
Thermal Characteristics
K
L
M
N
P
1.8 0.2
+
_
+
0.5
0.1
RthJC
RthJA
Thermal Resistance, Junction-to-Case
3.1
℃/W
℃/W
_
1.0 0.1
+
0.96 MAX
1
2
3
Thermal Resistance, Junction-to-
Ambient
_
1.02 0.3
+
110
1. GATE
2. DRAIN
3. SOURCE
PIN CONNECTION
(KF3N50DZ/IZ)
IPAK(1)
D
G
S
2010. 11. 29
Revision No : 0
1/6