KBPC25005W THRU KBPC2510W
Reverse Voltage - 50 to 1000 Volts Forward Current -25.0 Amperes
SILICON BRIDGE RECTIFIERS
Features
KBPC-25W
1.181(30.0)
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
Ideal for printed circuit boards
1.102(28.0)
0.732(18.6)
HOLE FOR
NO.8 SCREW
0.692(17.6)
Low reverse leakage
-
AC
1.181(30.0)
1.102(28.0)
High forward surge current capability
High temperature soldering guaranteed:
260°C/10 seconds,5 lbs. (2.3kg) tension
0.732(18.6)
0.692(17.6)
~
-
AC
+
0.468(11.9)
0.429(10.9)
0.033x.250
(0.8x6.4)
Mechanical Data
0.452
MAX.
(11.5)
Case : JEDEC KBPC-25W Molded plastic body
~
Terminals : Solder plated, solderable per MIL-STD-750,Method 2026
Polarity : Polarity symbol marking on body
Mounting Position: Any
0.591
(15.0)
MAX.
Weight
: 0.93 ounce, 26.4 grams
0.042(1.10) DIA.
0.038(0.97)
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwisespecified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
MDD
MDD
MDD
MDD
MDD
MDD
MDD
SYMBOLS
UNITS
KBPC25005W KBPC2501W KBPC2502W KBPC2504W KBPC2506W KBPC2508W KBPC2510W
Marking Code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
V
V
V
50
30
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
Maximum DC blocking voltage
Maximum average forward
100
1000
TC=55°C ( N o t e 1 )
A
output rectified current at
I(AV)
25.0
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
300
IFSM
I2t
A
A2s
V
Rating for Fusing(t<8.3ms)
373
Maximum instantaneous forward voltage
drop per birdge element at12.5A
1.1
VF
Maximum DC reverse current
at rated DC blocking voltage
Isolation voltage from case to leads
T
A
=25°C
=100°C
10
1.0
μ
A
IR
T
A
mA
VAC
°C/W
°C
VIOS
2500
Typical Thermal Resistance (Note 2)
RθJA
2.0
Operating junction temperature range
storage temperature range
TJ
-65 to +150
-65 to +150
TSTG
°C
NOTES:
1.Unit mounted on 5” x 6” x4.9” thick(12.8cmx15.2cmx12.4cmcm)Al.plate.
2.Bolt dowm on heat-sink with silicone thermal compound between bridge and mounting surface for
maximum heat transfer efficiency with #8 screw.
DN:T20521A0
http://www.microdiode.com
Rev:2020A0
Page :1