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KBP202 PDF预览

KBP202

更新时间: 2024-11-20 22:47:43
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上华 - COMCHIP 二极管
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3页 139K
描述
Silicon Bridge Rectifiers

KBP202 数据手册

 浏览型号KBP202的Datasheet PDF文件第2页浏览型号KBP202的Datasheet PDF文件第3页 
Silicon Bridge Rectifiers  
CCOOMMCCHHIIPP  
www.comchiptech.com  
KBP200 Thru 2010  
Reverse Voltage: 50 - 1000 Volts  
Forward Current: 2.0 Amp  
KBP  
Features  
Diffused Junction  
KBP  
Min  
14.22  
10.67  
15.20  
4.57  
Low Forward Voltage Drop  
High Current Capability  
High Reliability  
Dim  
A
B
C
D
E
Max  
15.24  
11.68  
-
High Surge Current Capability  
Ideal for Printed Circuit Boards  
5.08  
4.10  
2.67  
0.86  
-
3.60  
G
H
I
2.16  
0.76  
1.52  
Mechanical Data  
Case: Molded Plastic  
J
K
L
11.68  
12.70  
3.2 X 45° Typical  
12.70  
-
Terminals: Plated Leads Solderable per  
MIL-STD-202, Method 208  
Weight: 1.7 grams (approx.)  
Mounting Position: Any  
All Dimensions in mm  
Marking: Type Number  
Maximum Ratings and Electrical Characterics  
Single Phase, half wave, 60Hz, resistive or inductive load.  
For capacitive load, derate current by 20%.  
KBP  
200  
KBP  
201  
KBP  
202  
KBP  
204  
KBP  
206  
KBP  
208  
KBP  
2010  
CHARACTERISTICS  
Symbol  
UNIT  
VRRM  
VRWM  
VR  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
50  
35  
100  
70  
200  
140  
400  
600  
420  
800  
560  
1000  
700  
V
VR(RMS)  
RMS Reverse Voltage  
280  
2.0  
V
A
Average Rectified Output Current @ TA = 50°C (Note  
1)  
IO  
Non-Repetitive Peak Forward Surge Current 8.3ms  
Single half sine-wave superimposed on rate load  
(JEDEC Method)  
IFSM  
60  
A
Forward Voltage (per element) @IF = 2.0A  
VFM  
IRM  
1.1  
10  
500  
V
Peak Reverse Current  
@TA = 25°C  
uA  
At Rated DC Blocking Voltage @TA = 100°C  
I2t  
Cj  
A2s  
pF  
Rating for Fusing (t<8.3ms)  
Typical Junction Capacitance per element (Note 2)  
Typical Thermal Resistance (Note 3)  
15  
25  
R
30  
K/W  
°C  
JA  
Tj, TSTG  
-55 to +160  
Operating and Storage Temperature Range  
Note: 1. Leads maintained at ambient temperature at a distance of 9.5mm from the case.  
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.  
3. Thermal resistance junction to ambient mounted on PC board with 12mm2 copper pad.  
MDS0306002A  
Page 1  

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