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KBP200 PDF预览

KBP200

更新时间: 2024-11-26 18:06:23
品牌 Logo 应用领域
合科泰 - HOTTECH /
页数 文件大小 规格书
2页 230K
描述
KBP

KBP200 数据手册

 浏览型号KBP200的Datasheet PDF文件第2页 
KBP200-KBP210  
Bridge Rectifier  
Features  
!
Diffused Junction  
!
!
!
!
!
!
Low Forward Voltage Drop  
High Current Capability  
High Reliability  
High Surge Current Capability  
Ideal for Printed Circuit Boards  
UL Recognized File # E157705  
L
A
KBP  
Dim  
A
B
C
D
E
Min  
14.22  
10.67  
15.2  
4.57  
3.60  
2.16  
0.76  
1.52  
11.68  
12.7  
Max  
15.24  
11.68  
B
J
+
~
~
-
5.08  
4.10  
2.67  
0.86  
C
K
Mechanical Data  
!
!
G
H
I
Case: Molded Plastic  
H
I
Terminals: Plated Leads Solderable per  
MIL-STD-202, Method 208  
Polarity: As Marked on Body  
Weight: 1.7 grams (approx.)  
Mounting Position: Any  
J
12.7  
E
K
L
!
!
!
!
G
3.2 x 45° Typical  
D
All Dimensions in mm  
Marking: Type Number  
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified  
Single Phase, half wave, 60Hz, resistive or inductive load.  
For capacitive load, derate current by 20%.  
KBP  
200  
KBP  
201  
KBP  
202  
KBP  
204  
KBP  
206  
KBP  
208  
KBP  
210  
Characteristic  
Symbol  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
VRRM  
VRWM  
VR  
50  
35  
100  
70  
200  
140  
400  
600  
420  
800  
560  
1000  
700  
V
RMS Reverse Voltage  
VR(RMS)  
IO  
280  
2.0  
V
A
Average Rectified Output Current  
(Note 1)  
@TA = 50°C  
Non-Repetitive Peak Forward Surge Current  
8.3ms Single half sine-wave superimposed on  
rated load (JEDEC Method)  
IFSM  
60  
A
Forward Voltage (per element)  
@IF = 2.0A  
VFM  
IRM  
1.1  
V
Peak Reverse Current  
At Rated DC Blocking Voltage  
@TA = 25°C  
@TA = 100°C  
10  
500  
µA  
Rating for Fusing (t<8.3ms)  
I2t  
Cj  
15  
25  
A2s  
pF  
Typical Junction Capacitance per element (Note 2)  
Typical Thermal Resistance (Note 3)  
RJA  
Tj, TSTG  
30  
K/W  
°C  
Operating and Storage Temperature Range  
-55 to +165  
Note: 1. Leads maintained at ambient temperature at a distance of 9.5mm from the case.  
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.  
3. Thermal resistance junction to ambient mounted on PC board with 12mm2 copper pad.  
©GUANGDONG HOTTECH INDUSTRIAL CO.,LTD  
E-mail:hkt@heketai.com  

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