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KBJ410GS PDF预览

KBJ410GS

更新时间： 2024-11-21 14:55:19
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
3页 418K
描述
Bulk:20pcs/Tube,1Kpcs/Box,2Kpcs/Carton;

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中文翻译

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KBJ410GS 数据手册

 浏览型号KBJ410GS的Datasheet PDF文件第2页浏览型号KBJ410GS的Datasheet PDF文件第3页 
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‡ Halogen Free Available Upon Request By Adding Suffix "-HF"  
‡ Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix  
Designates Compliant. See Ordering Information)  
‡ /RZꢅ)RUZDUGꢅ9ROWDJHꢅ'URS and High Current Capability  
‡ Epoxy Meets UL 94 V-0 Flammability Rating  
Maximum Ratings  
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‡ Typical Thermal Resistance: 3°C/W Junction to Case(Note2)  
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TC= 125°C,With Heatsink  
4A  
Average  
Forward Current  
IF(AV)  
TA= 25°C,Without Heatsink  
2.6A  
',0(16,216  
00  
Peak Forward  
Surge Current  
,1&+(6  
IFSM  
135A  
8.3ms, Half Sine  
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ꢂꢃꢋꢊꢈ ꢂꢃꢋꢆꢋ ꢌꢃꢄꢂ ꢈꢃꢋꢂ  
ꢂꢃꢋꢅꢌ ꢂꢃꢋꢉꢄ ꢈꢃꢈꢂ ꢈꢃꢉꢂ  
ꢂꢃꢋꢌꢈ ꢂꢃꢋꢊꢂ ꢌꢃꢈꢂ ꢌꢃꢉꢂ  
ꢂꢃꢋꢇꢇ ꢂꢃꢋꢌꢈ ꢌꢃꢋꢂ ꢌꢃꢈꢂ  
ꢂꢃꢋꢌꢂ ꢂꢃꢋꢈꢆ ꢌꢃꢌꢂ ꢌꢃꢅꢂ  
ꢂꢃꢂꢌꢊ ꢂꢃꢂꢈꢌ ꢂꢃꢄꢂ ꢋꢃꢋꢂ  
ꢂꢃꢂꢊꢄ ꢂꢃꢂꢅꢊ ꢋꢃꢊꢂ ꢋꢃꢄꢂ  
ꢂꢃꢆꢆꢄ ꢂꢃꢅꢂꢄ ꢋꢅꢃꢂꢂ ꢋꢉꢃꢂꢂ  
ꢂꢃꢇꢉꢅ ꢂꢃꢌꢂꢌ ꢅꢃꢌꢂ ꢅꢃꢅꢂ  
ꢂꢃꢂꢄꢉ ꢂꢃꢋꢋꢈ ꢇꢃꢊꢂ ꢇꢃꢄꢂ  
ꢂꢃꢂꢇꢈ ꢂꢃꢂꢌꢋ ꢂꢃꢆꢂ ꢂꢃꢉꢂ  
ꢂꢃꢌꢆꢆ ꢂꢃꢈꢋꢌ ꢄꢃꢌꢂ ꢋꢂꢃꢊꢂ  
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Maximum Forward  
Voltage Drop Per  
Element  
IFM = 2A Per Diode;  
VF  
1.0V  
TJ= 25°C  
Maximum DC  
Reverse Current At  
Rated DC Blocking  
Voltage  
5μA  
ĭ
TJ = 25°C  
IR  
100uA  
TJ = 125°C  
VISO  
I2t  
2KV  
Terminals to Case, AC 1 Minute  
t<8.3ms  
Dielecric Strength  
Rating for Fusing  
75.6A2s  
Typical Junction  
Capacitance  
Measured at  
1.0MHz, VR=4.0V  
CJ  
38 pF  
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ĭ
Note: 1. High Temperature Solder Exemption Applied, See EU Directive Annex 7a.  
2. Device mounted on 75mm x 45mm x 5.5mm Aluminum Plate Heatsink.  
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Rev.3-1-08252022  
ꢁꢂꢃ  
0&&6(0,ꢀ&20  
123

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