是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | FBGA, BGA63,10X12,32 | Reach Compliance Code: | compliant |
风险等级: | 5.84 | 最长访问时间: | 30 ns |
命令用户界面: | YES | 数据轮询: | NO |
JESD-30 代码: | R-PBGA-B63 | 内存密度: | 268435456 bit |
内存集成电路类型: | FLASH | 内存宽度: | 16 |
部门数/规模: | 2K | 端子数量: | 63 |
字数: | 16777216 words | 字数代码: | 16000000 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 16MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA63,10X12,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, FINE PITCH |
页面大小: | 256 words | 并行/串行: | PARALLEL |
电源: | 3/3.3 V | 认证状态: | Not Qualified |
就绪/忙碌: | YES | 部门规模: | 8K |
最大待机电流: | 0.00005 A | 子类别: | Flash Memories |
最大压摆率: | 0.025 mA | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 切换位: | NO |
类型: | NAND TYPE | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K9F5616U0C-HIB00 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TBGA-63 | |
K9F5616U0C-JCB0 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PBGA63, | |
K9F5616U0C-JCB00 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PBGA63, 9 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63 | |
K9F5616U0C-JCB0T | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PBGA63, | |
K9F5616U0C-JIB0 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PBGA63, | |
K9F5616U0C-JIB00 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PBGA63, 9 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63 | |
K9F5616U0C-JIB0T | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PBGA63, | |
K9F5616U0C-P | SAMSUNG |
获取价格 |
512Mb/256Mb 1.8V NAND Flash Errata | |
K9F5616U0C-PCB0 | SAMSUNG |
获取价格 |
512Mb/256Mb 1.8V NAND Flash Errata | |
K9F5616U0C-PCB00 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 |